Hui-Min Tsui

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Isothermal plate assembly with predetermined shape and method for m...
- Patent number 7,322,102
- Issue date Jan 29, 2008
- Cpumate Inc.
- Kuo-Len Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for manufacturing heat-dissipating device with isothermal pl...
- Patent number 7,237,338
- Issue date Jul 3, 2007
- Cpumate Inc.
- Kuo-Len Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection structure for thermal conducting medium of heat dissipat...
- Patent number 7,068,514
- Issue date Jun 27, 2006
- Cpumate Inc.
- Chi-Lin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating device with uniform heat points
- Patent number 7,021,368
- Issue date Apr 4, 2006
- Cpumate Inc.
- Kuo-Len Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Dual-layer heat dissipating structure
- Patent number 6,918,429
- Issue date Jul 19, 2005
- Cpumate Inc.
- Kuo-Len Lin
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Isothermal plate assembly with predetermined shape and method for m...
- Publication number 20060144571
- Publication date Jul 6, 2006
- Topseed Technology Corp.
- Kuo-Len Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat-dissipating device with isothermal plate assembly of predeterm...
- Publication number 20060144561
- Publication date Jul 6, 2006
- CPUMATE INC.
- Kuo-Len Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for integrating heat conductor with heat dissipating fin
- Publication number 20050193561
- Publication date Sep 8, 2005
- Kuo-Len Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Protection structure for thermal conducting medium of heat dissipat...
- Publication number 20050180115
- Publication date Aug 18, 2005
- Chi-Lin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipating device with uniform heat points
- Publication number 20050098304
- Publication date May 12, 2005
- Kuo-Len Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DUAL-LAYER HEAT DISSIPATING STRUCTURE
- Publication number 20050092465
- Publication date May 5, 2005
- Kuo-Len Lin
- F28 - HEAT EXCHANGE IN GENERAL