Hui Peng Koh

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Spacer-less low-K dielectric processes
- Patent number 8,624,329
- Issue date Jan 7, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Yong Meng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to remove spacer after salicidation to enhance contact etch...
- Patent number 7,999,325
- Issue date Aug 16, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Young Way Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing silicide defects in integrated circuits
- Patent number 7,960,283
- Issue date Jun 14, 2011
- Chartered Semiconductor Manufacturing, Ltd.
- Jeff Jianhui Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system employing sacrificial spacers
- Patent number 7,892,900
- Issue date Feb 22, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing silicide defects in integrated circuits
- Patent number 7,745,320
- Issue date Jun 29, 2010
- Chartered Semiconductor Manufacturing, Ltd.
- Jeff Jianhui Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer-less low-k dielectric processes
- Patent number 7,615,427
- Issue date Nov 10, 2009
- Chartered Semiconductor Manufacturing, Ltd.
- Yong Meng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to remove spacer after salicidation to enhance contact etch...
- Patent number 7,445,978
- Issue date Nov 4, 2008
- Chartered Semiconductor Manufacturing, Ltd.
- Young Way Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite stress spacer
- Patent number 7,256,084
- Issue date Aug 14, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Khee Yong Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR REDUCING SILICIDE DEFECTS IN INTEGRATED CIRCUITS
- Publication number 20100267236
- Publication date Oct 21, 2010
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Jianhui YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacer-less Low-K Dielectric Processes
- Publication number 20100059831
- Publication date Mar 11, 2010
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Yong Meng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING SILICIDE DEFECTS IN INTEGRATED CIRCUITS
- Publication number 20090289309
- Publication date Nov 26, 2009
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Jianhui YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM EMPLOYING SACRIFICIAL SPACERS
- Publication number 20090250762
- Publication date Oct 8, 2009
- Chartered Semiconductor Manufacturing LTD.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM EMPLOYING FEED-FORWARD CONTROL
- Publication number 20090179307
- Publication date Jul 16, 2009
- Chartered Semiconductor Manufacturing LTD.
- Wenzhan Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REMOVE SPACER AFTER SALICIDATION TO ENHANCE CONTACT ETCH...
- Publication number 20090026549
- Publication date Jan 29, 2009
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Young Way Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEM HAVING COMPLEMENTARY STRAINED CHANNELS
- Publication number 20080315317
- Publication date Dec 25, 2008
- Chartered Semiconductor Manufacturing LTD.
- Chung Woh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacer-less low-k dielectric processes
- Publication number 20070281410
- Publication date Dec 6, 2007
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Yong Meng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite stress spacer
- Publication number 20060252194
- Publication date Nov 9, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Khee Yong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to remove spacer after salicidation to enhance contact etch...
- Publication number 20060249794
- Publication date Nov 9, 2006
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Young Way Teh
- H01 - BASIC ELECTRIC ELEMENTS

Hui Peng Koh

Person

Patents Grantslast 30 patents

Spacer-less low-K dielectric processes

Method to remove spacer after salicidation to enhance contact etch...

Method for reducing silicide defects in integrated circuits

Integrated circuit system employing sacrificial spacers

Method for reducing silicide defects in integrated circuits

Spacer-less low-k dielectric processes

Method to remove spacer after salicidation to enhance contact etch...

Composite stress spacer

Patents Applicationslast 30 patents

METHOD FOR REDUCING SILICIDE DEFECTS IN INTEGRATED CIRCUITS

Spacer-less Low-K Dielectric Processes

METHOD FOR REDUCING SILICIDE DEFECTS IN INTEGRATED CIRCUITS

INTEGRATED CIRCUIT SYSTEM EMPLOYING SACRIFICIAL SPACERS

INTEGRATED CIRCUIT SYSTEM EMPLOYING FEED-FORWARD CONTROL

METHOD TO REMOVE SPACER AFTER SALICIDATION TO ENHANCE CONTACT ETCH...

SEMICONDUCTOR SYSTEM HAVING COMPLEMENTARY STRAINED CHANNELS

Spacer-less low-k dielectric processes

Composite stress spacer

Method to remove spacer after salicidation to enhance contact etch...