Membership
Tour
Register
Log in
Hui Teng Wang
Follow
Person
Muar, MY
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Molded semiconductor package having a package-in-package structure...
Patent number
10,861,828
Issue date
Dec 8, 2020
Infineon Technologies AG
Hui Teng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-in-package structure for semiconductor devices and methods...
Patent number
10,418,343
Issue date
Sep 17, 2019
Infineon Technologies AG
Hui Teng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic array and chip package
Patent number
9,111,772
Issue date
Aug 18, 2015
Infineon Technologies AG
Volker Strutz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with multiple chips and substrate in metal cap
Patent number
8,916,958
Issue date
Dec 23, 2014
Infineon Technologies AG
Chong Yee Tong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Molded Semiconductor Package Having a Package-in-Package Structure...
Publication number
20190348397
Publication date
Nov 14, 2019
Hui Teng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package-in-Package Structure for Semiconductor Devices and Methods...
Publication number
20190172815
Publication date
Jun 6, 2019
INFINEON TECHNOLOGIES AG
Hui Teng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC ARRAY AND CHIP PACKAGE
Publication number
20150214297
Publication date
Jul 30, 2015
INFINEON TECHNOLOGIES AG
Volker Strutz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH MULTIPLE CHIPS AND SUBSTRATE IN METAL CAP
Publication number
20100270667
Publication date
Oct 28, 2010
INFINEON TECHNOLOGIES AG
Chong Yee Tong
H01 - BASIC ELECTRIC ELEMENTS