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Hui-Wen Lin
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Warpage reduction
Patent number
11,164,749
Issue date
Nov 2, 2021
Xilinx, Inc.
Nui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Testing of bonded wafers and structures for testing bonded wafers
Patent number
11,119,146
Issue date
Sep 14, 2021
Xilinx, Inc.
Nui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC die with dummy structures
Patent number
11,114,344
Issue date
Sep 7, 2021
Xilinx, Inc.
Hui-Wen Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device apparatus with multiple thermally conductive path...
Patent number
10,720,377
Issue date
Jul 21, 2020
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF TESTING STRUCTURES AND STACKING WAFERS
Publication number
20230317529
Publication date
Oct 5, 2023
Xilinx, Inc.
Yan WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATH...
Publication number
20200152546
Publication date
May 14, 2020
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS