Hui-Ying Ding

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame with conductive clip for mounting a semiconductor die wi...
- Patent number 10,163,762
- Issue date Dec 25, 2018
- Vishay General Semiconductor LLC
- Hui-Ying Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Axial semiconductor package
- Patent number 9,041,188
- Issue date May 26, 2015
- Vishay General Semiconductor LLC
- Wan-Lan Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for series connection of two die or chips in s...
- Patent number 7,768,104
- Issue date Aug 3, 2010
- Vishay General Semiconductor, Inc.
- Ta-Te Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME WITH CONDUCTIVE CLIP FOR MOUNTING A SEMICONDUCTOR DIE WI...
- Publication number 20160365305
- Publication date Dec 15, 2016
- Vishay General Semiconductor LLC
- Hui-Ying Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AXIAL SEMICONDUCTOR PACKAGE
- Publication number 20140131842
- Publication date May 15, 2014
- Vishay General Semiconductor LLC
- Wan-Lan Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SERIES CONNECTION OF TWO DIE OR CHIPS IN S...
- Publication number 20090236705
- Publication date Sep 24, 2009
- VISHAY GENERAL SEMICONDUCTOR, INC.
- TA-TE CHOU
- H01 - BASIC ELECTRIC ELEMENTS