Hui-Ying HSIEH

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package
- Patent number 11,728,252
- Issue date Aug 15, 2023
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,127,707
- Issue date Sep 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,037,868
- Issue date Jun 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,707,157
- Issue date Jul 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,615,105
- Issue date Apr 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,083,888
- Issue date Sep 25, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package
- Patent number 8,889,488
- Issue date Nov 18, 2014
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 8,546,950
- Issue date Oct 1, 2013
- Advanced Semiconductor Engineering Inc.
- Shin-Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210020594
- Publication date Jan 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200243427
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200194356
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200194327
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190122969
- Publication date Apr 25, 2019
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20180358276
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20170365543
- Publication date Dec 21, 2017
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20170148746
- Publication date May 25, 2017
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20140011325
- Publication date Jan 9, 2014
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120032341
- Publication date Feb 9, 2012
- Shin-Hua CHAO
- H01 - BASIC ELECTRIC ELEMENTS

Hui-Ying HSIEH

Person

Patents Grantslast 30 patents

Semiconductor device package

Semiconductor package structure and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Method for manufacturing semiconductor package

Semiconductor package and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF