HUI ZENG

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Shenzhen City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 9,125,334
- Issue date Sep 1, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Hui Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 9,095,082
- Issue date Jul 28, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Hui Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component device and connector assembly having same
- Patent number 8,481,854
- Issue date Jul 9, 2013
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Hui Zeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20120023744
- Publication date Feb 2, 2012
- ZHEN DING TECHNOLOGY CO., LTD.
- HUI ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20120011713
- Publication date Jan 19, 2012
- FOXCONN ADVANCED TECHNOLOGY INC.
- HUI ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT DEVICE AND CONNECTOR ASSEMBLY HAVING SAME
- Publication number 20110297437
- Publication date Dec 8, 2011
- FOXCONN ADVANCED TECHNOLOGY INC.
- HUI ZENG
- H01 - BASIC ELECTRIC ELEMENTS