Huibin Chen

Person

Shanghai, CN

People

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250118617
- Publication date Apr 10, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Huibin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, POWER SUPPLY SYSTEM, VEHICLE, AND PHOTOVOLTAIC SYSTEM
- Publication number 20250070055
- Publication date Feb 27, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Fengqun Lang
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD AND APPARATUS FOR DESIGNING SUBSTRATE OF POWER MODULE, AND T...
- Publication number 20240354482
- Publication date Oct 24, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Wuhua LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER MODULE AND VEHICLE-MOUNTED POWER CIRCUIT
- Publication number 20240312895
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Huibin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, POWER SUPPLY CIRCUIT, AND CHIP
- Publication number 20240170439
- Publication date May 23, 2024
- Huawei Technologies Co., Ltd
- Fengqun Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-SYMMETRICAL SEMICONDUCTOR ARRANGEMENT
- Publication number 20240006330
- Publication date Jan 4, 2024
- Huawei Technologies Co., Ltd
- Juergen HOEGERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED STRUCTURE, ELECTRIC POWER CONTROL SYSTEM, AND MANUFACTURIN...
- Publication number 20230395556
- Publication date Dec 7, 2023
- Huawei Digital Power Technologies Co., Ltd.
- Zhihua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation Structure and Encapsulation Method of Power Module
- Publication number 20230268251
- Publication date Aug 24, 2023
- Huawei Technologies Co.,Ltd.
- Huibin Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, PACKAGED STRUCTURE, AND ELECTRONIC DEVICE
- Publication number 20230230928
- Publication date Jul 20, 2023
- Huawei Technologies Co., Ltd.
- Huibin Chen
- H01 - BASIC ELECTRIC ELEMENTS

Huibin Chen

Person

Patents Applicationslast 30 patents

POWER MODULE AND MANUFACTURING METHOD THEREFOR

POWER MODULE AND POWER CONVERSION APPARATUS

POWER MODULE, POWER SUPPLY SYSTEM, VEHICLE, AND PHOTOVOLTAIC SYSTEM

METHOD AND APPARATUS FOR DESIGNING SUBSTRATE OF POWER MODULE, AND T...

POWER MODULE AND VEHICLE-MOUNTED POWER CIRCUIT

POWER MODULE, POWER SUPPLY CIRCUIT, AND CHIP

HIGH-SYMMETRICAL SEMICONDUCTOR ARRANGEMENT

PACKAGED STRUCTURE, ELECTRIC POWER CONTROL SYSTEM, AND MANUFACTURIN...

Encapsulation Structure and Encapsulation Method of Power Module

SUBSTRATE, PACKAGED STRUCTURE, AND ELECTRONIC DEVICE