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Patents Grants
last 30 patents
Information
Patent Grant
Press-fit power module and related methods
Patent number
12,119,576
Issue date
Oct 15, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jie Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power device module with dummy pad die layout
Patent number
11,935,817
Issue date
Mar 19, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Yusheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly processes for semiconductor device assemblies including sp...
Patent number
11,594,510
Issue date
Feb 28, 2023
Semiconductor Components Industries, LLC
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High power module semiconductor package with multiple submodules
Patent number
11,127,651
Issue date
Sep 21, 2021
Semiconductor Components Industries, LLC
Jie Chang
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Semiconductor device assemblies including spacer with embedded semi...
Patent number
10,991,670
Issue date
Apr 27, 2021
Semiconductor Components Industries, LLC
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Press-fit power module and related methods
Patent number
10,804,626
Issue date
Oct 13, 2020
Semiconductor Components Industries, LLC
Jie Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Press-fit power module and related methods
Patent number
10,566,713
Issue date
Feb 18, 2020
Semiconductor Components Industries, LLC
Jie Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High power module semiconductor package with multiple submodules
Patent number
10,553,517
Issue date
Feb 4, 2020
Semiconductor Components Industries, LLC
Jie Chang
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Patents Applications
last 30 patents
Information
Patent Application
POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT
Publication number
20240222231
Publication date
Jul 4, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Yusheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSEMBLY PROCESSES FOR SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING SP...
Publication number
20210225797
Publication date
Jul 22, 2021
Semiconductor Components Industries, LLC
Yong LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT
Publication number
20210118774
Publication date
Apr 22, 2021
Semiconductor Components Industries, LLC
Yusheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRESS-FIT POWER MODULE AND RELATED METHODS
Publication number
20210021065
Publication date
Jan 21, 2021
Semiconductor Components Industries, LLC
Jie CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES
Publication number
20200194336
Publication date
Jun 18, 2020
Semiconductor Components Industries, LLC
Jie Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRESS-FIT POWER MODULE AND RELATED METHODS
Publication number
20200144744
Publication date
May 7, 2020
Semiconductor Components Industries, LLC
Jie CHANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING SPACER WITH EMBEDDED SEMI...
Publication number
20200105706
Publication date
Apr 2, 2020
Semiconductor Components Industries, LLC
Yong LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES
Publication number
20190221493
Publication date
Jul 18, 2019
Semiconductor Components Industries, LLC
Jie CHANG
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
PRESS-FIT POWER MODULE AND RELATED METHODS
Publication number
20190214749
Publication date
Jul 11, 2019
Semiconductor Components Industries, LLC
Jie CHANG
H01 - BASIC ELECTRIC ELEMENTS