Huicheng CHANG

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method and device to reduce epitaxial defects due to contact stress...
- Patent number 12,283,515
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Sih-Jie Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,278,141
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable chemical vapor deposition (FCVD) using multi-step anneal t...
- Patent number 12,266,574
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation of nanostructures for nano-FET
- Patent number 12,255,101
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding system and method of using the same
- Patent number 12,255,171
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic bonding gap control and tool for wafer bonding
- Patent number 12,249,592
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system with sealing gasket and method for using the same
- Patent number 12,237,211
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacture by monitoring relative...
- Patent number 12,230,532
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,327
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,218,196
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a doped fin well
- Patent number 12,211,901
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bau-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding apparatus and method
- Patent number 12,211,820
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial layer for semiconductor process
- Patent number 12,205,994
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsan-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation method for reducing roughness of patterned resist...
- Patent number 12,198,931
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact formation with reduced dopant loss and increased dimensions
- Patent number 12,199,156
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing tool and method of using an embedded chamber
- Patent number 12,191,174
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device by driving hydrogen into a...
- Patent number 12,183,581
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hongfa Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding
- Patent number 12,165,888
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,153,350
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Gun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor contacts and methods of forming the same
- Patent number 12,154,949
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ting Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing spacing between conductive features through implantation
- Patent number 12,112,977
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor contact with reduced contact resistance
- Patent number 12,107,086
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with implant and method of manufacturing same
- Patent number 12,100,738
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient controlled two-step thermal treatment for spin-on coating l...
- Patent number 12,087,592
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable size fin structures
- Patent number 12,087,847
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,087,578
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial structures for stacked semiconductor devices
- Patent number 12,074,068
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal loss prevention using implantation
- Patent number 12,068,195
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate spacer structure and method of forming same
- Patent number 12,062,709
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A DOPED FIN WELL
- Publication number 20250120146
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bau-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION
- Publication number 20250096041
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION WITH REDUCED DOPANT LOSS AND INCREASED DIMENSIONS
- Publication number 20250098206
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250044708
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Gun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR CONTACTS AND METHODS OF FORMING THE SAME
- Publication number 20240395871
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ting Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20240395606
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHOD OF USING AN EMBEDDED CHAMBER
- Publication number 20240395581
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Apparatus and Method
- Publication number 20240387451
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240387661
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20240387180
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source/Drain Structure of Semiconductor Device and Method of Formin...
- Publication number 20240387700
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD FOR USING THE SAME
- Publication number 20240387232
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...
- Publication number 20240387188
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20240387445
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Dopant Source/Drain Regions and Methods of Forming Same
- Publication number 20240379446
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR ISOLATION REGIONS
- Publication number 20240379461
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL
- Publication number 20240379407
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING
- Publication number 20240379616
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAKAGE REDUCTION BY HALO-IMP TECHNOLOGY IN MESA REGION OF NANO SHE...
- Publication number 20240379663
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SU...
- Publication number 20240377263
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tz-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20240379751
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...
- Publication number 20240363404
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL STRUCTURES FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20240363417
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE SIZE FIN STRUCTURES
- Publication number 20240363736
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING SPACING BETWEEN CONDUCTIVE FEATURES THROUGH IMPLANTATION
- Publication number 20240363399
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A NANO-FET SEMICONDUCTOR DEVICE
- Publication number 20240332401
- Publication date Oct 3, 2024
- Tawan Semiconductor Manufacturing Co., Ltd.
- Li-Chi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240321751
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Depositing and Oxidizing Silicon Liner for Forming Isolation Regions
- Publication number 20240274465
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Kai Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20240274527
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240274606
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS

Huicheng CHANG

Person

Patents Grantslast 30 patents

Method and device to reduce epitaxial defects due to contact stress...

Semiconductor devices and methods of manufacture

Flowable chemical vapor deposition (FCVD) using multi-step anneal t...

Ion implantation of nanostructures for nano-FET

Wafer bonding system and method of using the same

Dynamic bonding gap control and tool for wafer bonding

Bonding system with sealing gasket and method for using the same

Semiconductor device, method of manufacture by monitoring relative...

Semiconductor device and method

Semiconductor device and method of manufacture

Semiconductor device having a doped fin well

Wafer bonding apparatus and method

Sacrificial layer for semiconductor process

Ion implantation method for reducing roughness of patterned resist...

Contact formation with reduced dopant loss and increased dimensions

Semiconductor processing tool and method of using an embedded chamber

Method of forming a semiconductor device by driving hydrogen into a...

Bottom lateral expansion of contact plugs through implantation

Method and system for bonding

Method of manufacturing semiconductor devices

Transistor contacts and methods of forming the same

Reducing spacing between conductive features through implantation

Field effect transistor contact with reduced contact resistance

Semiconductor device with implant and method of manufacturing same

Ambient controlled two-step thermal treatment for spin-on coating l...

Variable size fin structures

Semiconductor structure and method of forming the same

Epitaxial structures for stacked semiconductor devices

Metal loss prevention using implantation

Gate spacer structure and method of forming same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A DOPED FIN WELL

BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION

CONTACT FORMATION WITH REDUCED DOPANT LOSS AND INCREASED DIMENSIONS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

TRANSISTOR CONTACTS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

SEMICONDUCTOR PROCESSING TOOL AND METHOD OF USING AN EMBEDDED CHAMBER

Wafer Bonding Apparatus and Method

Semiconductor Device and Method

DEPOSITION WINDOW ENLARGEMENT

Source/Drain Structure of Semiconductor Device and Method of Formin...

BONDING SYSTEM AND METHOD FOR USING THE SAME

AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...

WAFER BONDING SYSTEM AND METHOD OF USING THE SAME

Dual Dopant Source/Drain Regions and Methods of Forming Same

TRANSISTOR ISOLATION REGIONS

TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL

DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING

LEAKAGE REDUCTION BY HALO-IMP TECHNOLOGY IN MESA REGION OF NANO SHE...

APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SU...

Semiconductor Device and Method of Manufacture

ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...

EPITAXIAL STRUCTURES FOR STACKED SEMICONDUCTOR DEVICES

VARIABLE SIZE FIN STRUCTURES

REDUCING SPACING BETWEEN CONDUCTIVE FEATURES THROUGH IMPLANTATION

METHOD OF FORMING A NANO-FET SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

Depositing and Oxidizing Silicon Liner for Forming Isolation Regions

METHODS OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME