Huifang Jiao

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Shenzhen, CN

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Patents Grantslast 30 patents

Information Patent Grant
Data reading/writing method, memory, storage apparatus, and terminal
- Patent number 12,183,425
- Issue date Dec 31, 2024
- Huawei Technologies Co., Ltd.
- Huifang Jiao
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid bonding structure and hybrid bonding method
- Patent number 11,756,922
- Issue date Sep 12, 2023
- Huawei Technologies Co., Ltd.
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
- Publication number 20240178167
- Publication date May 30, 2024
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD...
- Publication number 20230163043
- Publication date May 25, 2023
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA READING/WRITING METHOD, MEMORY, STORAGE APPARATUS, AND TERMINAL
- Publication number 20220406348
- Publication date Dec 22, 2022
- Huawei Technologies Co., Ltd
- Huifang JIAO
- G11 - INFORMATION STORAGE
Information Patent Application
HYBRID BONDING STRUCTURE AND HYBRID BONDING METHOD
- Publication number 20220077105
- Publication date Mar 10, 2022
- Huawei Technologies Co.,Ltd.
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS