Huili Fu

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
Methods of making an electronic component package and semiconductor...
- Patent number 8,241,966
- Issue date Aug 14, 2012
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Man-Lung Sham
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of Making an Electronic Component Package and Semiconductor...
- Publication number 20090294931
- Publication date Dec 3, 2009
- Man-Lung Sham
- H01 - BASIC ELECTRIC ELEMENTS