Huilin Ren

Person

Amherst, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,171,063
- Issue date Dec 17, 2024
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density electrical connector
- Patent number 11,901,660
- Issue date Feb 13, 2024
- Amphenol Corporation
- Thomas S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,758,656
- Issue date Sep 12, 2023
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,057,995
- Issue date Jul 6, 2021
- Amphenol Corporation
- Marc B. Cartier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed, high density electrical connector
- Patent number 10,958,007
- Issue date Mar 23, 2021
- Amphenol Corporation
- Thomas S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical connector
- Patent number 9,825,391
- Issue date Nov 21, 2017
- Amphenol Corporation
- Thomas S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density electrical connector
- Patent number 8,814,595
- Issue date Aug 26, 2014
- Amphenol Corporation
- Thomas S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density electrical connector and PCB footprint
- Patent number 8,272,877
- Issue date Sep 25, 2012
- Amphenol Corporation
- Philip T. Stokoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density electrical connector with variable insertion and reten...
- Patent number 8,182,289
- Issue date May 22, 2012
- Amphenol Corporation
- Philip T. Stokoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board for high speed, high density electrical conne...
- Patent number 7,508,681
- Issue date Mar 24, 2009
- Amphenol Corporation
- Jason J. Payne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for high speed, high density electrical conne...
- Patent number 7,242,592
- Issue date Jul 10, 2007
- Amphenol Corporation
- Jason J. Payne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed, high density electrical connector and connector assembly
- Patent number 6,814,619
- Issue date Nov 9, 2004
- Teradyne, Inc.
- Philip T. Stokoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density electrical connector
- Patent number 6,780,059
- Issue date Aug 24, 2004
- Teradyne, Inc.
- Jason J. Payne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density electrical connector
- Patent number 6,776,659
- Issue date Aug 17, 2004
- Teradyne, Inc.
- Philip T. Stokoe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20250063662
- Publication date Feb 20, 2025
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20230371178
- Publication date Nov 16, 2023
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20210336363
- Publication date Oct 28, 2021
- Amphenol Corporation
- Thomas S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20210315102
- Publication date Oct 7, 2021
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20190380204
- Publication date Dec 12, 2019
- Amphenol Corporation
- Marc B. Cartier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20190181576
- Publication date Jun 13, 2019
- Amphenol Corporation
- Thomas S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20180248289
- Publication date Aug 30, 2018
- Amphenol Corporation
- Thomas S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20140335735
- Publication date Nov 13, 2014
- Thomas S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20120214344
- Publication date Aug 23, 2012
- Thomas S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ELECTRICAL CONNECTOR WITH VARIABLE INSERTION AND RETEN...
- Publication number 20110212649
- Publication date Sep 1, 2011
- Philip T. Stokoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ELECTRICAL CONNECTOR AND PCB FOOTPRINT
- Publication number 20110212632
- Publication date Sep 1, 2011
- Amphenol Corporation
- Philip T. Stokoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board for high speed, high density electrical conne...
- Publication number 20080030970
- Publication date Feb 7, 2008
- Jason J. Payne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board for high speed, high density electrical conne...
- Publication number 20040264153
- Publication date Dec 30, 2004
- Jason J. Payne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Backplane footprint for high speed, high density electrical connectors

High speed, high density electrical connector

Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

High speed, high density electrical connector

Method of forming an electrical connector

High speed, high density electrical connector

High density electrical connector and PCB footprint

High density electrical connector with variable insertion and reten...

Printed circuit board for high speed, high density electrical conne...

Printed circuit board for high speed, high density electrical conne...

High speed, high density electrical connector and connector assembly

High speed, high density electrical connector

High speed, high density electrical connector

Patents Applicationslast 30 patents

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

HIGH DENSITY ELECTRICAL CONNECTOR WITH VARIABLE INSERTION AND RETEN...

HIGH DENSITY ELECTRICAL CONNECTOR AND PCB FOOTPRINT

Printed circuit board for high speed, high density electrical conne...

Printed circuit board for high speed, high density electrical conne...