Hung-An Teng

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Substrateless integrated circuit packages and methods of forming same
- Patent number 10,290,604
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company
- Lin-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure for yield improvement
- Patent number 10,056,347
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company
- Tzu-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrateless integrated circuit packages and methods of forming same
- Patent number 9,842,825
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via keep out zone formation method and system
- Patent number 9,640,490
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure for yield improvement
- Patent number 9,553,053
- Issue date Jan 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via keep out zone formation method and system
- Patent number 9,054,166
- Issue date Jun 9, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device including an opening in a flexible substrate and met...
- Patent number 8,836,094
- Issue date Sep 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via keep out zone formation along different crystal...
- Patent number 8,604,619
- Issue date Dec 10, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Substrateless Integrated Circuit Packages and Methods of Forming Same
- Publication number 20180114770
- Publication date Apr 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure for Yield Improvement
- Publication number 20170133346
- Publication date May 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated Circuit Packages and Methods of Forming Same
- Publication number 20160071816
- Publication date Mar 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via Keep Out Zone Formation Method and System
- Publication number 20150270230
- Publication date Sep 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE INCLUDING AN OPENING IN A FLEXIBLE SUBSTRATE AND MET...
- Publication number 20140264803
- Publication date Sep 18, 2014
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via Keep Out Zone Formation Method and System
- Publication number 20140045332
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure for Yield Improvement
- Publication number 20140027900
- Publication date Jan 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via Keep Out Zone Formation Method and System
- Publication number 20130049220
- Publication date Feb 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Hung-An Teng

Person

Patents Grantslast 30 patents

Substrateless integrated circuit packages and methods of forming same

Bump structure for yield improvement

Substrateless integrated circuit packages and methods of forming same

Through silicon via keep out zone formation method and system

Bump structure for yield improvement

Through silicon via keep out zone formation method and system

Package device including an opening in a flexible substrate and met...

Through silicon via keep out zone formation along different crystal...

Patents Applicationslast 30 patents

Substrateless Integrated Circuit Packages and Methods of Forming Same

Bump Structure for Yield Improvement

Integrated Circuit Packages and Methods of Forming Same

Through Silicon Via Keep Out Zone Formation Method and System

PACKAGE DEVICE INCLUDING AN OPENING IN A FLEXIBLE SUBSTRATE AND MET...

Through Silicon Via Keep Out Zone Formation Method and System

Bump Structure for Yield Improvement

Through Silicon Via Keep Out Zone Formation Method and System