Hung-Chi Wei

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-gate semiconductor structure and method of manufacturing the...
- Patent number 12,107,162
- Issue date Oct 1, 2024
- Winbond Electronics Corp.
- Hung-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuse device and manufacturing method thereof
- Patent number 11,916,016
- Issue date Feb 27, 2024
- Winbond Electronics Corp.
- Hung-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory structure and method for manufacturing the same
- Patent number 11,700,724
- Issue date Jul 11, 2023
- Winbond Electronics Corp.
- Hung-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory and method for manufacturing the same
- Patent number 11,690,214
- Issue date Jun 27, 2023
- Winbond Electronics Corp.
- Hung-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory and method of fabricating the same
- Patent number 11,664,435
- Issue date May 30, 2023
- Winbond Electronics Corp.
- Hung-Yu Wei
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,393,821
- Issue date Jul 19, 2022
- Winbond Electronics Corp.
- Kazutaka Manabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,018,140
- Issue date May 25, 2021
- Winbond Electronics Corp.
- Yi-Hao Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF
- Publication number 20240334688
- Publication date Oct 3, 2024
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240276706
- Publication date Aug 15, 2024
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240179891
- Publication date May 30, 2024
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230215803
- Publication date Jul 6, 2023
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220367475
- Publication date Nov 17, 2022
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY AND METHOD OF FABRICATING THE SAME
- Publication number 20220344343
- Publication date Oct 27, 2022
- WINBOND ELECTRONICS CORP.
- Hung-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216208
- Publication date Jul 7, 2022
- WINBOND ELECTRONICS CORP.
- Kazutaka Manabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220216210
- Publication date Jul 7, 2022
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE...
- Publication number 20210257491
- Publication date Aug 19, 2021
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200335506
- Publication date Oct 22, 2020
- WINBOND ELECTRONICS CORP.
- Yi-Hao CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of making the same
- Publication number 20080009153
- Publication date Jan 10, 2008
- Siliconware Precision Industries Co., Ltd.
- Toniady Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit card module and method for fabricating the same
- Publication number 20070267732
- Publication date Nov 22, 2007
- Siliconware Precision Industries Co., Ltd.
- Toniady Tan
- G06 - COMPUTING CALCULATING COUNTING

Hung-Chi Wei

Person

Patents Grantslast 30 patents

Multi-gate semiconductor structure and method of manufacturing the...

Anti-fuse device and manufacturing method thereof

Semiconductor memory structure and method for manufacturing the same

Dynamic random access memory and method for manufacturing the same

Dynamic random access memory and method of fabricating the same

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

ANTI-FUSE DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

DYNAMIC RANDOM ACCESS MEMORY AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DYNAMIC RANDOM ACCESS MEMORY AND METHOD FOR MANUFACTURING THE SAME

MULTI-GATE SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor package and method of making the same

Circuit card module and method for fabricating the same