Hung-Chih Chou

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon-germanium Fins and methods of processing the same in field-...
- Patent number 12,136,651
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Shan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tray and carrier tray assembly using the same
- Patent number 12,017,817
- Issue date Jun 25, 2024
- Radiant(Guangzhou) Opto-Electronics Co., Ltd
- Hung-Yi Hsu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
- Patent number 11,973,052
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged isolation barrier with integrated magnetics
- Patent number 11,948,721
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Ying-Chuan Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die pad cavity
- Patent number 11,942,448
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin loss prevention
- Patent number 11,923,250
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Ju Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die mounted in a recess of die pad
- Patent number 11,862,538
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- Chung-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Germanium hump reduction
- Patent number 11,854,819
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and related methods
- Patent number 11,848,241
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jiu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with high angle wire bonding and non-...
- Patent number 11,848,297
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bent fin devices
- Patent number 11,791,336
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of semiconductor device with gate all around struc...
- Patent number 11,757,018
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-An Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet processing apparatus
- Patent number 11,749,050
- Issue date Sep 5, 2023
- Masterwork Automodules Tech Corp. Ltd
- Hung-Hsun Chou
- G07 - CHECKING-DEVICES
Information Patent Grant
Exposed heat-generating devices
- Patent number 11,742,265
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Hung-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device and method
- Patent number 11,735,430
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with multiple exposed pads
- Patent number 11,735,506
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Hung-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin loss prevention
- Patent number 11,705,372
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Ju Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Germanium hump reduction
- Patent number 11,437,245
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single wavelength reflection for leadframe brightness measurement
- Patent number 11,421,981
- Issue date Aug 23, 2022
- Texas Instruments Incorporated
- Hung-Yu Chou
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure and related methods
- Patent number 11,328,959
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jiu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless charging mousepad structure and processes
- Patent number 11,183,865
- Issue date Nov 23, 2021
- Hades-Gaming Corporation
- Hung-Jen Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mouse pad structure having wireless charging coil and manufacturing...
- Patent number 11,061,495
- Issue date Jul 13, 2021
- Hades-Gaming Corporation
- Hung-Jen Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Peripheral device
- Patent number 11,025,020
- Issue date Jun 1, 2021
- DEXIN ELECTRONIC LTD.
- Ho-Lung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless charging mousepad and processes thereof
- Patent number 11,003,263
- Issue date May 11, 2021
- Hades-Gaming Corporation
- Hung-Jen Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fin field-effect transistor device and method
- Patent number 10,964,548
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless power-supplying mouse pad with apparatus-identifying function
- Patent number 10,938,229
- Issue date Mar 2, 2021
- Hades-Gaming Corporation
- Hung-Jen Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint recognition device with wake-up function and driving me...
- Patent number 10,908,731
- Issue date Feb 2, 2021
- AU OPTRONICS CORPORATION
- Yi-Hsin Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer input apparatus, pointing device and setting method thereof
- Patent number 10,890,984
- Issue date Jan 12, 2021
- HADES-GAMING CORP.
- Hung-Jen Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413268
- Publication date Dec 12, 2024
- EPISTAR CORPORATION
- Yi-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PRESENTING THREE-DIMENSIONAL CONTENT AND THRE...
- Publication number 20240404259
- Publication date Dec 5, 2024
- ACER INCORPORATED
- Kai-Hsiang Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISTRIBUTED DATA PROCESSING SYSTEM AND DISTRIBUTED DATA PROCESSING...
- Publication number 20240404260
- Publication date Dec 5, 2024
- ACER INCORPORATED
- Kai-Hsiang Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AUTOMATIC EFFICIENT SMALL MODEL SELECTION FOR MONOCULAR DEPTH ESTIM...
- Publication number 20240404258
- Publication date Dec 5, 2024
- ACER INCORPORATED
- Kai-Hsiang Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BENT FIN DEVICES
- Publication number 20240387533
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Ming KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices And Methods Of Fabricating The Same
- Publication number 20240363725
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ling Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PAD CAVITY
- Publication number 20240274569
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
- Publication number 20240274570
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OBJECTS AUTOMATIC LABELING METHOD AND SYSTEM APPLYING THE SAME
- Publication number 20240212372
- Publication date Jun 27, 2024
- Industrial Technology Research Institute
- Chih-Neng Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE DISPLAY METHOD AND 3D DISPLAY SYSTEM
- Publication number 20240121373
- Publication date Apr 11, 2024
- ACER INCORPORATED
- Kai-Hsiang Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
- Publication number 20240113155
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Loss Prevention
- Publication number 20240087961
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ju CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FORMAT IMAGE DETECTION METHOD AND ELECTRONIC APPARATUS USING THE...
- Publication number 20240046608
- Publication date Feb 8, 2024
- ACER INCORPORATED
- Kai-Hsiang Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BENT FIN DEVICES
- Publication number 20240021612
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Ming KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-GERMANIUM FINS AND METHODS OF PROCESSING THE SAME IN FIELD-...
- Publication number 20230387213
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Shan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230380130
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ju CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FINGER WITH Z-DIRECTION OBSTRUCTION FEATURE
- Publication number 20230317571
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hsiang Ming Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MULTI-CHANNEL DEVICES WITH ANTI-PUNCH-THROUGH FEATURES
- Publication number 20230197820
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAINING DATA GENERATION DEVICE, TRAINING DATA GENERATION METHOD US...
- Publication number 20230150141
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Hung-Chun CHOU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
DIE PAD RECESSES
- Publication number 20230063262
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Chung-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PAD CAVITY
- Publication number 20230016577
- Publication date Jan 19, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE ALL AROUND DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230010541
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ju CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN LOSS PREVENTION
- Publication number 20230008005
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Ju CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...
- Publication number 20230005874
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE ALL AROUND STRUC...
- Publication number 20220384605
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-An YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Germanium Hump Reduction
- Publication number 20220375756
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Hao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OBJECT POSE ESTIMATION SYSTEM, EXECUTION METHOD THEREOF AND GRAPHIC...
- Publication number 20220362945
- Publication date Nov 17, 2022
- Industrial Technology Research Institute
- Dong-Chen TSAI
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
- Publication number 20220352111
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUSE PAD WITH USABLE DOUBLE SURFACE
- Publication number 20220342492
- Publication date Oct 27, 2022
- Hung-Jen CHOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CARRIER TRAY AND CARRIER TRAY ASSEMBLY USING THE SAME
- Publication number 20220281636
- Publication date Sep 8, 2022
- Radiant(Guangzhou) Opto-Electronics Co., Ltd
- Hung-Yi HSU
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Hung-Chih Chou

Person

Patents Grantslast 30 patents

Silicon-germanium Fins and methods of processing the same in field-...

Mechanical couplings designed to resolve process constraints

Carrier tray and carrier tray assembly using the same

Stud bump for wirebonding high voltage isolation barrier connection

Packaged isolation barrier with integrated magnetics

Integrated circuit die pad cavity

Fin loss prevention

Semiconductor die mounted in a recess of die pad

Germanium hump reduction

Semiconductor structure and related methods

Semiconductor device packages with high angle wire bonding and non-...

Bent fin devices

Formation method of semiconductor device with gate all around struc...

Sheet processing apparatus

Exposed heat-generating devices

Fin field-effect transistor device and method

Packages with multiple exposed pads

Fin loss prevention

Germanium hump reduction

Single wavelength reflection for leadframe brightness measurement

Semiconductor structure and related methods

Wireless charging mousepad structure and processes

Mouse pad structure having wireless charging coil and manufacturing...

Peripheral device

Wireless charging mousepad and processes thereof

Fin field-effect transistor device and method

Wireless power-supplying mouse pad with apparatus-identifying function

Fingerprint recognition device with wake-up function and driving me...

Computer input apparatus, pointing device and setting method thereof

Wire bond clamp design and lead frame capable of engaging with same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SYSTEM AND METHOD FOR PRESENTING THREE-DIMENSIONAL CONTENT AND THRE...

DISTRIBUTED DATA PROCESSING SYSTEM AND DISTRIBUTED DATA PROCESSING...

AUTOMATIC EFFICIENT SMALL MODEL SELECTION FOR MONOCULAR DEPTH ESTIM...

BENT FIN DEVICES

Semiconductor Devices And Methods Of Fabricating The Same

INTEGRATED CIRCUIT DIE PAD CAVITY

STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION

OBJECTS AUTOMATIC LABELING METHOD AND SYSTEM APPLYING THE SAME

IMAGE DISPLAY METHOD AND 3D DISPLAY SYSTEM

WIRE BONDS FOR GALVANIC ISOLATION DEVICE

Fin Loss Prevention

3D FORMAT IMAGE DETECTION METHOD AND ELECTRONIC APPARATUS USING THE...

BENT FIN DEVICES

SILICON-GERMANIUM FINS AND METHODS OF PROCESSING THE SAME IN FIELD-...

MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

LEAD FINGER WITH Z-DIRECTION OBSTRUCTION FEATURE

METHOD AND MULTI-CHANNEL DEVICES WITH ANTI-PUNCH-THROUGH FEATURES

TRAINING DATA GENERATION DEVICE, TRAINING DATA GENERATION METHOD US...

DIE PAD RECESSES

INTEGRATED CIRCUIT DIE PAD CAVITY

GATE ALL AROUND DEVICE AND METHOD OF FORMING THE SAME

FIN LOSS PREVENTION

SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...

FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE ALL AROUND STRUC...

Germanium Hump Reduction

OBJECT POSE ESTIMATION SYSTEM, EXECUTION METHOD THEREOF AND GRAPHIC...

STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION

MOUSE PAD WITH USABLE DOUBLE SURFACE

CARRIER TRAY AND CARRIER TRAY ASSEMBLY USING THE SAME