TREA

Hung-Hsing Kuo

Follow

Person

  • Kaohsiung, TW
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic package structure
    • Patent number 12,211,780
    • Issue date Jan 28, 2025
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 12,156,336
    • Issue date Nov 26, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying Kuo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic device
    • Patent number 12,131,972
    • Issue date Oct 29, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Po-Chih Pan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device package and method of manufacturing the same
    • Patent number 12,068,259
    • Issue date Aug 20, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Wei Da Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package shielding structure
    • Patent number 12,009,313
    • Issue date Jun 11, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Meng-Jen Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 11,990,385
    • Issue date May 21, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Li-Chieh Hung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 11,991,827
    • Issue date May 21, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chun-Yen Ting
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic package
    • Patent number 11,973,018
    • Issue date Apr 30, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Blockchain compliance verification network
    • Patent number 11,676,117
    • Issue date Jun 13, 2023
    • International Business Machines Corporation
    • Nitin Gaur
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Semiconductor device package and method of manufacturing the same
    • Patent number 11,605,598
    • Issue date Mar 14, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Wei Da Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Blockchain settlement network
    • Patent number 11,599,858
    • Issue date Mar 7, 2023
    • International Business Machines Corporation
    • Nitin Gaur
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Semiconductor device package
    • Patent number 11,328,999
    • Issue date May 10, 2022
    • Advanced Semiconductor Engineering, Inc.
    • Fu-Chen Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device package and method of manufacturing the same
    • Patent number 11,232,998
    • Issue date Jan 25, 2022
    • Advanced Semiconductor Engineering, Inc.
    • Ming-Fong Jhong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor chip, semiconductor device and manufacturing process...
    • Patent number 10,014,268
    • Issue date Jul 3, 2018
    • Advanced Semiconductor Engineering, Inc.
    • Chun-Jun Zhuang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20250174536
    • Publication date May 29, 2025
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250054829
    • Publication date Feb 13, 2025
    • Advanced Semiconductor Engineering, Inc.
    • Po-Chih PAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250038084
    • Publication date Jan 30, 2025
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND CHIPLET MODULE
    • Publication number 20250029970
    • Publication date Jan 23, 2025
    • Advanced Semiconductor Engineering, Inc.
    • Jung Jui KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR DRYING WAFER
    • Publication number 20240387163
    • Publication date Nov 21, 2024
    • NATIONAL SUN YAT-SEN UNIVERSITY
    • TING-CHANG CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE DEVICE
    • Publication number 20240345341
    • Publication date Oct 17, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Jung Jui KANG
    • G02 - OPTICS
  • Information Patent Application

    OPTOELECTRONIC PACKAGE
    • Publication number 20240345315
    • Publication date Oct 17, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chun-Yen TING
    • G02 - OPTICS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20240332192
    • Publication date Oct 3, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Po-I WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE DEVICE AND ELECTRONIC DEVICE
    • Publication number 20240329300
    • Publication date Oct 3, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Po-I WU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240329344
    • Publication date Oct 3, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Jung Jui KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE
    • Publication number 20240282694
    • Publication date Aug 22, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTOELECTRONIC DEVICE AND METHOD OF TRANSMITTING OPTICAL SIGNAL
    • Publication number 20240264368
    • Publication date Aug 8, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Hung-Chun KUO
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240130043
    • Publication date Apr 18, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chun-Yen TING
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240008184
    • Publication date Jan 4, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying KUO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230275000
    • Publication date Aug 31, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Li-Chieh HUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230274998
    • Publication date Aug 31, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Po-Chih PAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE
    • Publication number 20230253299
    • Publication date Aug 10, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE
    • Publication number 20230253305
    • Publication date Aug 10, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230223354
    • Publication date Jul 13, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Wei Da LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20230215790
    • Publication date Jul 6, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE SHIELDING STRUCTURE
    • Publication number 20230104397
    • Publication date Apr 6, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Meng-Jen WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BLOCKCHAIN COMPLIANCE VERIFICATION NETWORK
    • Publication number 20210350343
    • Publication date Nov 11, 2021
    • International Business Machines Corporation
    • Nitin Gaur
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    BLOCKCHAIN SETTLEMENT NETWORK
    • Publication number 20210350458
    • Publication date Nov 11, 2021
    • International Business Machines Corporation
    • Nitin Gaur
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20210327822
    • Publication date Oct 21, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Wei Da LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20210202353
    • Publication date Jul 1, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Ming-Fong JHONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20210175175
    • Publication date Jun 10, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Fu-Chen CHU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
    • Publication number 20180052281
    • Publication date Feb 22, 2018
    • Advanced Semiconductor Engineering, Inc.
    • Hung-Chun KUO
    • G02 - OPTICS
  • Information Patent Application

    SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS...
    • Publication number 20170256508
    • Publication date Sep 7, 2017
    • Advanced Semiconductor Engineering, Inc.
    • Chun-Jun ZHUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Circuit for enhancing scan testing capability of a digital IC tester
    • Publication number 20040037227
    • Publication date Feb 26, 2004
    • Kuo-Hung Shih
    • G01 - MEASURING TESTING