Hung-I Tsai

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 11,117,796
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming semiconductor package and semiconductor package
- Patent number 11,014,805
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 10,710,871
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 10,508,023
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming micro electromechanical system sensor
- Patent number 10,384,933
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 9,919,914
- Issue date Mar 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro electromechanical system sensor and method of forming the same
- Patent number 9,725,310
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 9,617,143
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with through molding vias and method of making...
- Patent number 9,469,524
- Issue date Oct 18, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for TSV in MEMS structure
- Patent number 9,422,153
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for packaging a microelectromechanical system (MEMS) wafer...
- Patent number 9,403,674
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods for forming same
- Patent number 9,352,956
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for packaging a microelectromechanical system (MEMS) wafer...
- Patent number 9,315,378
- Issue date Apr 19, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with through molding vias
- Patent number 9,150,404
- Issue date Oct 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for TSV in MEMS structure
- Patent number 9,085,456
- Issue date Jul 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 8,941,152
- Issue date Jan 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package bag expanding device
- Patent number 5,765,338
- Issue date Jun 16, 1998
- Hung-Wen Tsai
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
MEMS Devices Including MEMS Dies and Connectors Thereto
- Publication number 20200024129
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
- Publication number 20200002161
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Devices Including MEMS Dies and Connectors Thereto
- Publication number 20180194613
- Publication date Jul 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING MICRO ELECTROMECHANICAL SYSTEM SENSOR
- Publication number 20170313581
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Devices and Methods for Forming Same
- Publication number 20160368762
- Publication date Dec 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR PACKAGING A MICROELECTROMECHANICAL SYSTEM (MEMS) WAFER...
- Publication number 20160046483
- Publication date Feb 18, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR PACKAGING A MICROELECTROMECHANICAL SYSTEM (MEMS) WAFER...
- Publication number 20160046484
- Publication date Feb 18, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH MOLDING VIAS AND METHOD OF MAKING...
- Publication number 20160002027
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Vacuum Sealed MEMS and CMOS Package
- Publication number 20150329351
- Publication date Nov 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Support Structure for TSV in MEMS Structure
- Publication number 20150321902
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICES AND METHODS FOR FORMING SAME
- Publication number 20150197419
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO ELECTROMECHANICAL SYSTEM SENSOR AND METHOD OF FORMING THE SAME
- Publication number 20150175407
- Publication date Jun 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150166331
- Publication date Jun 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH MOLDING VIAS
- Publication number 20150166329
- Publication date Jun 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR CUTTING WAFER
- Publication number 20140273402
- Publication date Sep 18, 2014
- SURETECH TECHNOLOGY CO., LTD.
- Hung-Wen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CONVERSION METHOD AND MODULE FOR NAKED-EYE 3D DISPLAY
- Publication number 20140204175
- Publication date Jul 24, 2014
- Jar-Ferr YANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Support Structure for TSV in MEMS Structure
- Publication number 20130181355
- Publication date Jul 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Network hub
- Publication number 20020143910
- Publication date Oct 3, 2002
- Shih-Wei Chou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Hung-I Tsai

Person

Patents Grantslast 30 patents

MEMS devices including MEMS dies and connectors thereto

Method of forming semiconductor package and semiconductor package

MEMS devices including MEMS dies and connectors thereto

MEMS devices including MEMS dies and connectors thereto

Method of forming micro electromechanical system sensor

MEMS devices including MEMS dies and connectors thereto

Micro electromechanical system sensor and method of forming the same

Semiconductor device

Semiconductor device with through molding vias and method of making...

Support structure for TSV in MEMS structure

Methods for packaging a microelectromechanical system (MEMS) wafer...

MEMS devices and methods for forming same

Methods for packaging a microelectromechanical system (MEMS) wafer...

Semiconductor device with through molding vias

Support structure for TSV in MEMS structure

Semiconductor device

Package bag expanding device

Patents Applicationslast 30 patents

MEMS Devices Including MEMS Dies and Connectors Thereto

METHOD OF FORMING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

MEMS Devices Including MEMS Dies and Connectors Thereto

METHOD OF FORMING MICRO ELECTROMECHANICAL SYSTEM SENSOR

MEMS Devices and Methods for Forming Same

METHODS FOR PACKAGING A MICROELECTROMECHANICAL SYSTEM (MEMS) WAFER...

METHODS FOR PACKAGING A MICROELECTROMECHANICAL SYSTEM (MEMS) WAFER...

SEMICONDUCTOR DEVICE WITH THROUGH MOLDING VIAS AND METHOD OF MAKING...

Vacuum Sealed MEMS and CMOS Package

Support Structure for TSV in MEMS Structure

MEMS DEVICES AND METHODS FOR FORMING SAME

MICRO ELECTROMECHANICAL SYSTEM SENSOR AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH THROUGH MOLDING VIAS

METHOD FOR CUTTING WAFER

IMAGE CONVERSION METHOD AND MODULE FOR NAKED-EYE 3D DISPLAY

Support Structure for TSV in MEMS Structure

Network hub