Hung-Ju Chung

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Lead-free conductive paste composition
- Patent number 8,440,111
- Issue date May 14, 2013
- China Steel Corporation
- Rong-Zhi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and package substrate thereof
- Patent number 8,058,725
- Issue date Nov 15, 2011
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD-FREE CONDUCTIVE PASTE COMPOSITION
- Publication number 20120168689
- Publication date Jul 5, 2012
- CHINA STEEL CORPORATION
- Rong-Zhi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGE SUBSTRATE THEREOF
- Publication number 20080105974
- Publication date May 8, 2008
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mobile communication device
- Publication number 20070263750
- Publication date Nov 15, 2007
- BENQ CORPORATION
- Shih-Chieh Ou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE