Hung-Jui Kou

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Fan-out interconnect structure and methods forming the same
- Patent number 10,586,724
- Issue date Mar 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 10,297,494
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,186,462
- Issue date Jan 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 9,941,140
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20180211912
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20180151453
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME
- Publication number 20170345675
- Publication date Nov 30, 2017
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, INC.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Interconnect Structure and Methods Forming the Same
- Publication number 20170263489
- Publication date Sep 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS