Hung-Lin Yin

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Piezoresistive pressure sensor
- Patent number 10,156,489
- Issue date Dec 18, 2018
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating semiconductor devices having reinforcing ele...
- Patent number 9,553,055
- Issue date Jan 24, 2017
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Package structure and substrate bonding method
- Patent number 8,916,449
- Issue date Dec 23, 2014
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT CARRIER BOARD
- Publication number 20240292517
- Publication date Aug 29, 2024
- ASIA PACIFIC MICROSYSTEMS, INC.
- Jer-Wei HSIEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIEZORESISTIVE PRESSURE SENSOR
- Publication number 20170219449
- Publication date Aug 3, 2017
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICES HAVING REINFORCING ELE...
- Publication number 20160240490
- Publication date Aug 18, 2016
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICES HAVING HIGH-PRECISION...
- Publication number 20150279664
- Publication date Oct 1, 2015
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Combo Transducer and Combo Transducer Package
- Publication number 20130205899
- Publication date Aug 15, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Chang-Wen Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus for driving microfluid and driving method thereof
- Publication number 20070286739
- Publication date Dec 13, 2007
- Instrument Technology Research Center
- Jerwei Hsieh
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Hung-Lin Yin

Person

Patents Grantslast 30 patents

Piezoresistive pressure sensor

Method for fabricating semiconductor devices having reinforcing ele...

Package structure and substrate bonding method

Patents Applicationslast 30 patents

CIRCUIT CARRIER BOARD

PIEZORESISTIVE PRESSURE SENSOR

METHOD FOR FABRICATING SEMICONDUCTOR DEVICES HAVING REINFORCING ELE...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICES HAVING HIGH-PRECISION...

Package Structure and Substrate Bonding Method

Combo Transducer and Combo Transducer Package

Apparatus for driving microfluid and driving method thereof