Hung Liu

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,666,536
- Issue date May 30, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,607,974
- Issue date Mar 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Chun-Tang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package having embedded semicon...
- Patent number 9,397,081
- Issue date Jul 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package
- Patent number 9,224,646
- Issue date Dec 29, 2015
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having embedded semiconductor elements
- Patent number 9,177,859
- Issue date Nov 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,828,796
- Issue date Sep 9, 2014
- Siliconware Precision Industries Co., Ltd.
- Chieh-Yuan Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 8,766,456
- Issue date Jul 1, 2014
- Siliconware Precision Industries Co., Ltd.
- Hsi-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame structure having blocking surfaces and semiconductor pac...
- Patent number 7,459,770
- Issue date Dec 2, 2008
- Siliconware Precision Industries Co., Ltd.
- Wen-Shan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of controlling gas valves to reduce particles from CVD...
- Patent number 6,503,832
- Issue date Jan 7, 2003
- Macronix International Co., Ltd.
- Hung Wei Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flow control device
- Patent number 5,148,830
- Issue date Sep 22, 1992
- Hung Liu
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20170236783
- Publication date Aug 17, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160190099
- Publication date Jun 30, 2016
- Siliconware Precision Industries Co., Ltd.
- Yi-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING EMBEDDED SEMICON...
- Publication number 20160141281
- Publication date May 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160141227
- Publication date May 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Chun-Tang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20140342506
- Publication date Nov 20, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140332976
- Publication date Nov 13, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140042638
- Publication date Feb 13, 2014
- Siliconware Precision Industries Co., Ltd.
- Hung-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20140035156
- Publication date Feb 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Hsi-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE
- Publication number 20120313243
- Publication date Dec 13, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame structure and semiconductor package integrated with the...
- Publication number 20070111395
- Publication date May 17, 2007
- Siliconware Precision Industries Co., Ltd.
- Wen-Shan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for improving adhesion between intermetal diel...
- Publication number 20050253268
- Publication date Nov 17, 2005
- Shao-Ta Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[METAL SILICIDE STRUCTURE AND METHOD OF FORMING THE SAME]
- Publication number 20050009337
- Publication date Jan 13, 2005
- Hung-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Application of controlling gas valves to reduce particles from CVD...
- Publication number 20020111020
- Publication date Aug 15, 2002
- Hung Wei Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Package structure and fabrication method thereof

Package structure and fabrication method thereof

Fabrication method of semiconductor package having embedded semicon...

Method for fabricating semiconductor package

Semiconductor package having embedded semiconductor elements

Semiconductor package and method of manufacturing the same

Method of fabricating a semiconductor package

Lead frame structure having blocking surfaces and semiconductor pac...

Application of controlling gas valves to reduce particles from CVD...

Flow control device

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING EMBEDDED SEMICON...

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

CHIP-SCALE PACKAGE

Lead frame structure and semiconductor package integrated with the...

Method and structure for improving adhesion between intermetal diel...

[METAL SILICIDE STRUCTURE AND METHOD OF FORMING THE SAME]

Application of controlling gas valves to reduce particles from CVD...