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Hung-Ming Su
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Taichung City, TW
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor structure, manufacturing method thereof and method fo...
Patent number
11,688,651
Issue date
Jun 27, 2023
Winbond Electronics Corp.
Hung-Ming Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Layout for measuring overlapping state
Patent number
11,367,718
Issue date
Jun 21, 2022
Winbond Electronics Corp.
Chi-Hung Chan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
LAYOUT FOR MEASURING OVERLAPPING STATE
Publication number
20220189943
Publication date
Jun 16, 2022
WINBOND ELECTRONICS CORP.
Chi-Hung Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE, MANUFACTURING METHOD THEREOF AND METHOD FO...
Publication number
20200286796
Publication date
Sep 10, 2020
WINBOND ELECTRONICS CORP.
Hung-Ming Su
H01 - BASIC ELECTRIC ELEMENTS