Hung-Sheng CHO

Person

Chu-Nan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,249,588
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having adhesion layers for through vias
- Patent number 12,009,331
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,948,863
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,791,313
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit packages having adhesion laye...
- Patent number 11,715,717
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 11,605,607
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout modification method for exposure manufacturing process
- Patent number 11,594,528
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,594,472
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,455,040
- Issue date Sep 27, 2022
- Innolux Corporation
- Sheng-Nan Fan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,456,280
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,417,582
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,270,927
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,164,839
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for collecting information used in image-error...
- Patent number 11,150,561
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Wen Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Layout modification method for exposure manufacturing process
- Patent number 11,024,623
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Wen Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of controlling reticle masking blade positioning to minimize...
- Patent number 10,871,713
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Wen Cho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 10,833,053
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout modification method for exposure manufacturing process
- Patent number 10,720,419
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Wen Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for collecting information used in image-error...
- Patent number 10,712,651
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Wen Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of controlling reticle masking blade positioning to minimize...
- Patent number 10,642,158
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Wen Cho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Layout modification method for exposure manufacturing process
- Patent number 10,366,973
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Wen Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Touch panels and touch display devices
- Patent number 10,331,250
- Issue date Jun 25, 2019
- Innolux Corporation
- Wei-Chih Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Assistant pattern for measuring critical dimension of main pattern...
- Patent number 10,276,375
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid crystal display panel and manufacturing method thereof
- Patent number 9,465,256
- Issue date Oct 11, 2016
- Innolux Corporation
- Charles Chien
- G02 - OPTICS
Information Patent Grant
Liquid crystal display panel and manufacturing method thereof
- Patent number 9,349,913
- Issue date May 24, 2016
- Innolux Corporation
- Charles Chien
- G02 - OPTICS
Information Patent Grant
Liquid crystal display panel and manufacturing method thereof
- Patent number 9,343,621
- Issue date May 17, 2016
- Innolux Corporation
- Charles Chien
- G02 - OPTICS
Information Patent Grant
Liquid crystal display panel and manufacturing method thereof
- Patent number 9,147,802
- Issue date Sep 29, 2015
- Innolux Corporation
- Charles Chien
- G02 - OPTICS
Information Patent Grant
Liquid crystal display panel and manufacturing method thereof
- Patent number 9,082,666
- Issue date Jul 14, 2015
- Innolux Corporation
- Charles Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal display panel and manufacturing method thereof
- Patent number 9,036,125
- Issue date May 19, 2015
- Innolux Corporation
- Charles Chien
- G02 - OPTICS
Information Patent Grant
Liquid crystal display panel and manufacturing method thereof
- Patent number 8,570,478
- Issue date Oct 29, 2013
- Chimei Innolux Corporation
- Charles Chien
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240395757
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20240304511
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING ADHESION LAYERS FOR THROUGH VIAS
- Publication number 20240297140
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240243047
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240194569
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240096781
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ti Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHY SYSTEM AND METHODS
- Publication number 20230375940
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Chieh Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230369288
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING ADHESION LAYERS FOR THROUGH VIAS
- Publication number 20230317664
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230282558
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20230215831
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230187318
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230154830
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20220392872
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220336310
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220302066
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20220302065
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220189854
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220068746
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT MODIFICATION METHOD FOR EXPOSURE MANUFACTURING PROCESS
- Publication number 20210296303
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen CHO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICE
- Publication number 20210124423
- Publication date Apr 29, 2021
- InnoLux Corporation
- Sheng-Nan FAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210057382
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210057308
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR COLLECTING INFORMATION USED IN IMAGE-ERROR...
- Publication number 20200348586
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen CHO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
LAYOUT MODIFICATION METHOD FOR EXPOSURE MANUFACTURING PROCESS
- Publication number 20200350306
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen CHO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF CONTROLLING RETICLE MASKING BLADE POSITIONING TO MINIMIZE...
- Publication number 20200264515
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen CHO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200083189
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT MODIFICATION METHOD FOR EXPOSURE MANUFACTURING PROCESS
- Publication number 20190348409
- Publication date Nov 14, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen CHO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF CONTROLLING RETICLE MASKING BLADE POSITIONING TO MINIMIZE...
- Publication number 20190163046
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen CHO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD AND APPARATUS FOR COLLECTING INFORMATION USED IN IMAGE-ERROR...
- Publication number 20190137866
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen CHO
- G06 - COMPUTING CALCULATING COUNTING

Hung-Sheng CHO

Person

Patents Grantslast 30 patents

Semiconductor device and methods of manufacture

Integrated circuit packages having adhesion layers for through vias

Package structure and method of forming the same

Semiconductor package and method of forming the same

Methods of forming integrated circuit packages having adhesion laye...

Semiconductor device and methods of manufacture

Layout modification method for exposure manufacturing process

Package structure and method of forming the same

Display device

Semiconductor package and method of forming the same

Package structure and method of manufacturing the same

Package structure and method of forming the same

Package structure and method of manufacturing the same

Method and apparatus for collecting information used in image-error...

Layout modification method for exposure manufacturing process

Method of controlling reticle masking blade positioning to minimize...

Semiconductor package and method of forming the same

Layout modification method for exposure manufacturing process

Method and apparatus for collecting information used in image-error...

Method of controlling reticle masking blade positioning to minimize...

Layout modification method for exposure manufacturing process

Touch panels and touch display devices

Assistant pattern for measuring critical dimension of main pattern...

Liquid crystal display panel and manufacturing method thereof

Liquid crystal display panel and manufacturing method thereof

Liquid crystal display panel and manufacturing method thereof

Liquid crystal display panel and manufacturing method thereof

Liquid crystal display panel and manufacturing method thereof

Liquid crystal display panel and manufacturing method thereof

Liquid crystal display panel and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGES HAVING ADHESION LAYERS FOR THROUGH VIAS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE

LITHOGRAPHY SYSTEM AND METHODS

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGES HAVING ADHESION LAYERS FOR THROUGH VIAS

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Semiconductor Device and Methods of Manufacture

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Integrated Circuit Package and Method

Semiconductor Device and Methods of Manufacture

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

LAYOUT MODIFICATION METHOD FOR EXPOSURE MANUFACTURING PROCESS

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

METHOD AND APPARATUS FOR COLLECTING INFORMATION USED IN IMAGE-ERROR...

LAYOUT MODIFICATION METHOD FOR EXPOSURE MANUFACTURING PROCESS

METHOD OF CONTROLLING RETICLE MASKING BLADE POSITIONING TO MINIMIZE...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

LAYOUT MODIFICATION METHOD FOR EXPOSURE MANUFACTURING PROCESS

METHOD OF CONTROLLING RETICLE MASKING BLADE POSITIONING TO MINIMIZE...

METHOD AND APPARATUS FOR COLLECTING INFORMATION USED IN IMAGE-ERROR...