HUNG-WEI HSU

Person

Yun Lin, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Micro-roughened electrodeposited copper foil and copper clad laminate
- Patent number 12,120,816
- Issue date Oct 15, 2024
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing Sung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Advanced reverse treated electrodeposited copper foil and copper cl...
- Patent number 11,655,555
- Issue date May 23, 2023
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing Sung
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Advanced electrodeposited copper foil having island-shaped microstr...
- Patent number 11,408,087
- Issue date Aug 9, 2022
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing Sung
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Advanced electrodeposited copper foil and copper clad laminate usin...
- Patent number 11,332,839
- Issue date May 17, 2022
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing Sung
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20240357740
- Publication date Oct 24, 2024
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing SUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20210321514
- Publication date Oct 14, 2021
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing SUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
ADVANCED REVERSE-TREATED ELECTRODEPOSITED COPPER FOIL AND COPPER CL...
- Publication number 20200399775
- Publication date Dec 24, 2020
- CO-TECH DEVELOPMENT CORP.
- YUN-HSING SUNG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADVANCED TREATED ELECTRODEPOSITED COPPER FOIL HAVING LONG AND ISLAN...
- Publication number 20200399776
- Publication date Dec 24, 2020
- CO-TECH DEVELOPMENT CORP.
- YUN-HSING SUNG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20200404784
- Publication date Dec 24, 2020
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing SUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
ADVANCED REVERSE TREATED ELECTRODEPOSITED COPPER FOIL AND COPPER CL...
- Publication number 20200392640
- Publication date Dec 17, 2020
- CO-TECH DEVELOPMENT CORP.
- YUN-HSING SUNG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

HUNG-WEI HSU

Person

Patents Grantslast 30 patents

Micro-roughened electrodeposited copper foil and copper clad laminate

Advanced reverse treated electrodeposited copper foil and copper cl...

Advanced electrodeposited copper foil having island-shaped microstr...

Advanced electrodeposited copper foil and copper clad laminate usin...

Patents Applicationslast 30 patents

MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE

MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE

ADVANCED REVERSE-TREATED ELECTRODEPOSITED COPPER FOIL AND COPPER CL...

ADVANCED TREATED ELECTRODEPOSITED COPPER FOIL HAVING LONG AND ISLAN...

MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE

ADVANCED REVERSE TREATED ELECTRODEPOSITED COPPER FOIL AND COPPER CL...