Hung-Wen Su

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer film device and method
- Patent number 12,166,128
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structure having a barrier layer
- Patent number 12,165,975
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 12,159,838
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium-based liner for a copper interconnect
- Patent number 12,094,770
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally stable copper-alloy adhesion layer for metal interconnect...
- Patent number 12,080,594
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a contact structure
- Patent number 11,996,361
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating shield gate MOSFET
- Patent number 11,916,141
- Issue date Feb 27, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Hung-I Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a carbon-containing barrier layer
- Patent number 11,908,697
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company
- Rueijer Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method and machine of manufacture
- Patent number 11,851,749
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective capping processes and structures formed thereby
- Patent number 11,830,742
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device and method
- Patent number 11,810,857
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leakage current blocking circuit and leakage current blocking metho...
- Patent number 11,777,302
- Issue date Oct 3, 2023
- Realtek Semiconductor Corp.
- Hung-Der Su
- G01 - MEASURING TESTING
Information Patent Grant
Multi-layer film device and method
- Patent number 11,777,035
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming thereof
- Patent number 11,742,290
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 11,682,624
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier for semiconductor device and method
- Patent number 11,676,898
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and method of making
- Patent number 11,652,044
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 11,552,018
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-plating and apparatus for performing the same
- Patent number 11,535,950
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yuan Kao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnect structure of semiconductor device
- Patent number 11,527,476
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a carbon-containing barrier layer
- Patent number 11,527,411
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company
- Rueijer Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally stable copper-alloy adhesion layer for metal interconnect...
- Patent number 11,430,692
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective capping processes and structures formed thereby
- Patent number 11,380,542
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 11,374,127
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method and machine of manufacture
- Patent number 11,345,991
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deterioration detecting system and method for semiconductor process...
- Patent number 11,320,381
- Issue date May 3, 2022
- Top Technology Platform Co., Ltd.
- Chyuan-Ruey Lin
- G01 - MEASURING TESTING
Information Patent Grant
Device and method for reducing contact resistance of a metal
- Patent number 11,177,168
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Lien Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a carbon-containing barrier layer
- Patent number 11,062,909
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company
- Rueijer Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical vapor deposition process for semiconductor interconnection...
- Patent number 11,018,055
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Nai-Hao Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20240413087
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FILM DEVICE AND METHOD
- Publication number 20240395939
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20240387256
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME
- Publication number 20240379430
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...
- Publication number 20240350289
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun TSAI
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240312901
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM STRUCTURES
- Publication number 20240304551
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL CAP IN AN INTERCONNECT STRUCTURE
- Publication number 20240274555
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method and Machine of Manufacture
- Publication number 20240093357
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-LAYER FILM DEVICE AND METHOD
- Publication number 20230369500
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20230369224
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20230361039
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Interconnect Structure Having an Air Gap and S...
- Publication number 20230275025
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE
- Publication number 20230275019
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL DIRECT PATTERN PLATING METHOD
- Publication number 20230215807
- Publication date Jul 6, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Wen-Jiun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure Having a Carbon-Containing Barrier Layer
- Publication number 20230107176
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Rueijer Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20230068398
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES WITH BOTTOM-LESS BARRIERS AND LINERS
- Publication number 20230029867
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CONTACT STRUCTURE
- Publication number 20220384338
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...
- Publication number 20220367262
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diffusion Barrier for Semiconductor Device and Method
- Publication number 20220367376
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure Including Graphite and Method Forming Same
- Publication number 20220367266
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Film Device and Method
- Publication number 20220328690
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Capping Processes and Structures Formed Thereby
- Publication number 20220328309
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chien CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20220293528
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method and Machine of Manufacture
- Publication number 20220290291
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DATA PROCESSING METHOD AND SYSTEM FOR DETECTION OF DETERIORATION OF...
- Publication number 20220283099
- Publication date Sep 8, 2022
- TOP TECHNOLOGY PLATFORM CO., LTD.
- Chyuan-Ruey LIN
- G01 - MEASURING TESTING
Information Patent Application
CONTACT STRUCTURE AND METHOD OF MAKING
- Publication number 20220278040
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAKAGE CURRENT BLOCKING CIRCUIT AND LEAKAGE CURRENT BLOCKING METHO...
- Publication number 20220209523
- Publication date Jun 30, 2022
- Realtek Semiconductor Corp.
- HUNG-DER SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure of Semiconductor Device
- Publication number 20220165616
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS

Hung-Wen Su

Person

Patents Grantslast 30 patents

Multi-layer film device and method

Method of forming interconnect structure having a barrier layer

Chemical direct pattern plating method

Method of forming an interconnect structure having an air gap and s...

Ruthenium-based liner for a copper interconnect

Thermally stable copper-alloy adhesion layer for metal interconnect...

Method of making a contact structure

Method for fabricating shield gate MOSFET

Interconnect structure having a carbon-containing barrier layer

Semiconductor device, method and machine of manufacture

Selective capping processes and structures formed thereby

Via for semiconductor device and method

Leakage current blocking circuit and leakage current blocking metho...

Multi-layer film device and method

Interconnect structure and method of forming thereof

Method of forming an interconnect structure having an air gap and s...

Diffusion barrier for semiconductor device and method

Contact structure and method of making

Chemical direct pattern plating method

Electro-plating and apparatus for performing the same

Interconnect structure of semiconductor device

Interconnect structure having a carbon-containing barrier layer

Thermally stable copper-alloy adhesion layer for metal interconnect...

Selective capping processes and structures formed thereby

Multi-layer film device and method

Semiconductor device, method and machine of manufacture

Deterioration detecting system and method for semiconductor process...

Device and method for reducing contact resistance of a metal

Interconnect structure having a carbon-containing barrier layer

Physical vapor deposition process for semiconductor interconnection...

Patents Applicationslast 30 patents

Interconnect Structure and Method of Forming Thereof

MULTI-LAYER FILM DEVICE AND METHOD

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME

THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

ALUMINUM STRUCTURES

SELECTIVE METAL CAP IN AN INTERCONNECT STRUCTURE

Semiconductor Device, Method and Machine of Manufacture

MULTI-LAYER FILM DEVICE AND METHOD

VIA FOR SEMICONDUCTOR DEVICE AND METHOD

Interconnect Structure and Method of Forming Thereof

Method of Forming an Interconnect Structure Having an Air Gap and S...

SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE

CHEMICAL DIRECT PATTERN PLATING METHOD

Interconnect Structure Having a Carbon-Containing Barrier Layer

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

CONDUCTIVE STRUCTURES WITH BOTTOM-LESS BARRIERS AND LINERS

METHOD OF MAKING A CONTACT STRUCTURE

THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...

Diffusion Barrier for Semiconductor Device and Method

Interconnect Structure Including Graphite and Method Forming Same

Multi-Layer Film Device and Method

Selective Capping Processes and Structures Formed Thereby

Interconnect Structure and Method of Forming Thereof

Semiconductor Device, Method and Machine of Manufacture

DATA PROCESSING METHOD AND SYSTEM FOR DETECTION OF DETERIORATION OF...

CONTACT STRUCTURE AND METHOD OF MAKING

LEAKAGE CURRENT BLOCKING CIRCUIT AND LEAKAGE CURRENT BLOCKING METHO...

Interconnect Structure of Semiconductor Device