Hung-Yi Kuo

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having composite seed-barrier layer and metho...
- Patent number 12,322,682
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including auxiliary dielectric portion
- Patent number 12,322,688
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 12,322,696
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming RDLs and structure formed thereof
- Patent number 12,315,819
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,315,784
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,315,772
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,300,598
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,302,677
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography
- Patent number 12,298,667
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,293,988
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,283,545
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer material in a redistribution structure of a semiconductor p...
- Patent number 12,265,330
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,249,588
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable inductor and methods of manufacture
- Patent number 12,243,681
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system and method
- Patent number 12,242,197
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming same
- Patent number 12,222,545
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 12,218,001
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of forming the same
- Patent number 12,218,009
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,211,802
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,210,188
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,211,801
- Issue date Jan 28, 2025
- Parabellum Strategic Opportunities Fund LLC
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,210,200
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch module
- Patent number 12,204,692
- Issue date Jan 21, 2025
- Primax Electronics Ltd.
- Tse-Ping Kuan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 12,191,203
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan out device with a filler-free insulating material
- Patent number 12,191,222
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,183,691
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of forming the same
- Patent number 12,176,321
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250183168
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE INDUCTOR AND METHODS OF MANUFACTURE
- Publication number 20250166895
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250167075
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMATION METHOD THEREOF
- Publication number 20250140647
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Polymer Layers as the Encapsulant of Conductive Vias
- Publication number 20250140724
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20250133812
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20250123458
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118678
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming
- Publication number 20250118609
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250118682
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250096044
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan Out Device with a Filler-Free Insulating Material
- Publication number 20250096059
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250096203
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20250087627
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK INCLUDING SELF-SEALING VACUUM SEAL ASSEMBLIES AND METHO...
- Publication number 20250079228
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCIE CLOCK DETECTION CIRCUIT AND METHOD THEREOF
- Publication number 20250077460
- Publication date Mar 6, 2025
- MEDIATEK INC.
- Hung-Chang Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250079341
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT STRUCTURES FOR DIE PICK-AND-PLACEMENT AND METHODS OF USIN...
- Publication number 20250079329
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Redistribution Circuit Structure
- Publication number 20250069951
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070013
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DEVICE DIE
- Publication number 20250062224
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20250060676
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING PRISM STRUCTURE
- Publication number 20250060542
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHO...
- Publication number 20250054826
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250038073
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Han SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20250038148
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250029946
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOUCH MODULE
- Publication number 20250013304
- Publication date Jan 9, 2025
- Primax Electronics Ltd.
- Tse-Ping Kuan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240393685
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20240395595
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Hung-Yi Kuo

Person

Patents Grantslast 30 patents

Semiconductor package having composite seed-barrier layer and metho...

Package structure including auxiliary dielectric portion

Dual-mode wireless charging device

Method of forming RDLs and structure formed thereof

Semiconductor package and manufacturing method thereof

Package and manufacturing method thereof

Package structure and method of fabricating the same

Semiconductor device having a heat dissipation structure connected...

Semiconductor device and method

Lithography

Semiconductor package and method of forming the same

Package structure and method of manufacturing the same

Polymer material in a redistribution structure of a semiconductor p...

Semiconductor device and methods of manufacture

Programmable inductor and methods of manufacture

Apparatus, system and method

Package and method of forming same

Semiconductor package and method of fabricating semiconductor package

Semiconductor package and methods of forming the same

Package structure and method of fabricating the same

Semiconductor package and manufacturing method thereof

Chip package and method of forming the same

Photonic semiconductor device and method of manufacture

Semiconductor package and manufacturing method thereof

Touch module

Semiconductor package

Integrated fan out device with a filler-free insulating material

Semiconductor structure and method of forming the same

Manufacturing method of semiconductor package

Semiconductor packages and method of forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PROGRAMMABLE INDUCTOR AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND FORMATION METHOD THEREOF

Multiple Polymer Layers as the Encapsulant of Conductive Vias

SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME

Photonic Semiconductor Device and Method of Manufacture

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Packages and Methods of Forming

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Integrated Fan Out Device with a Filler-Free Insulating Material

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME

WAFER CHUCK INCLUDING SELF-SEALING VACUUM SEAL ASSEMBLIES AND METHO...

PCIE CLOCK DETECTION CIRCUIT AND METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

ALIGNMENT STRUCTURES FOR DIE PICK-AND-PLACEMENT AND METHODS OF USIN...

Method of Fabricating Redistribution Circuit Structure

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING DEVICE DIE

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

PACKAGE HAVING PRISM STRUCTURE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHO...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING SAME

PACKAGE STRUCTURE

TOUCH MODULE

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

Chuck Design and Method for Wafer