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Hung-Yi Wang

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  • Hsinhua, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    DISPLAY MODULE
    • Publication number 20100321282
    • Publication date Dec 23, 2010
    • HIMAX DISPLAY, INC.
    • Chia-Cheng Lai
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    STACKED DIE PACKAGE
    • Publication number 20090302483
    • Publication date Dec 10, 2009
    • HIMAX TECHNOLOGIES LIMITED
    • Shih-Hsuan LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD
    • Publication number 20090101513
    • Publication date Apr 23, 2009
    • Chia-Hui WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Underfill aiding process for a tape
    • Publication number 20070087481
    • Publication date Apr 19, 2007
    • HIMAX TECHNOLOGIES, INC.
    • Shwang-Shi Bai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    A METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD
    • Publication number 20060251873
    • Publication date Nov 9, 2006
    • Chia-Hui WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR