Hung-Yun Lin

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Murphy, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Wire bond damage detector including a detection bond pad over a fir...
- Patent number 12,159,808
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Hung-Yun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond damage detector including a detection bond pad over a fir...
- Patent number 11,521,904
- Issue date Dec 6, 2022
- Texas Instruments Incorporated
- Hung-Yun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH LOW-PROFILE POLYIMIDE LAYERS
- Publication number 20250096156
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo TIMBOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY FOR HIGH-POWER SEMICONDUCTO...
- Publication number 20240363462
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND DAMAGE DETECTOR INCLUDING A DETECTION BOND PAD OVER A FIR...
- Publication number 20230100709
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND DAMAGE DETECTOR
- Publication number 20210287950
- Publication date Sep 16, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yun Lin
- H01 - BASIC ELECTRIC ELEMENTS