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Hussain Shaukatuallah
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Endwell, NY, US
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last 30 patents
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Patent Grant
Attaching heat sinks directly to flip chips and ceramic chip carriers
Patent number
6,251,707
Issue date
Jun 26, 2001
International Business Machines Corporation
William Emmett Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Attaching heat sinks directly to flip chips and ceramic chip carriers
Patent number
6,069,023
Issue date
May 30, 2000
International Business Machines Corporation
William Emmett Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Attaching heat sinks directly to flip chips and ceramic chip carriers
Patent number
5,847,929
Issue date
Dec 8, 1998
International Business Machines Corporation
William Emmett Bernier
H01 - BASIC ELECTRIC ELEMENTS