Hussain Shaukatullah

Person

Tucson, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure for removably attaching a heat sink to surface mount pack...
- Patent number 6,219,238
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Frank E. Andros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single layer leadframe design with groundplane capability
- Patent number 5,814,877
- Issue date Sep 29, 1998
- International Business Machines Corporation
- Steven Joel Diffenderfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for attaching heat sinks directly to chip carrier modules...
- Patent number 5,785,799
- Issue date Jul 28, 1998
- International Business Machines Corporation
- Thomas Moran Culnane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier modules with heat sinks attached by flexible-epoxy
- Patent number 5,744,863
- Issue date Apr 28, 1998
- International Business Machines Corporation
- Thomas Moran Culnane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching heat sinks directly to chip carrier modules us...
- Patent number 5,672,548
- Issue date Sep 30, 1997
- International Business Machines Corporation
- Thomas Moran Culnane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making single layer leadframe having groundplane capability
- Patent number 5,639,694
- Issue date Jun 17, 1997
- International Business Machines Corporation
- Steven Joel Diffenderfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single layer leadframe design with groundplane capability
- Patent number 5,543,657
- Issue date Aug 6, 1996
- International Business Machines Corporation
- Steven J. Diffenderfer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Encapsulated thermally conductive electrically insulating assembly...
- Publication number 20060182952
- Publication date Aug 17, 2006
- Roger Javier Justo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible, thermally conductive, electrically insulating gap filler,...
- Publication number 20030128519
- Publication date Jul 10, 2003
- International Business Machine Corporartion
- Roger Javier Justo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hussain Shaukatullah

Person

Patents Grantslast 30 patents

Structure for removably attaching a heat sink to surface mount pack...

Single layer leadframe design with groundplane capability

Apparatus for attaching heat sinks directly to chip carrier modules...

Chip carrier modules with heat sinks attached by flexible-epoxy

Method for attaching heat sinks directly to chip carrier modules us...

Method for making single layer leadframe having groundplane capability

Single layer leadframe design with groundplane capability

Patents Applicationslast 30 patents

Encapsulated thermally conductive electrically insulating assembly...

Flexible, thermally conductive, electrically insulating gap filler,...