Hwa Sun Park

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Package of light emitting diode with heat sink
- Patent number 9,356,005
- Issue date May 31, 2016
- Research & Business Foundation Sungkyunkwan University
- Su-jeong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor device, semiconductor device having the...
- Patent number 9,136,455
- Issue date Sep 15, 2015
- Research & Business Foundation Sungkyunkwan University
- Su Jeong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor device, semiconductor device having the...
- Patent number 9,000,593
- Issue date Apr 7, 2015
- Research & Business Foundation Sungkyunkwan University
- Su Jeong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing cavity of core substrate
- Patent number 8,633,397
- Issue date Jan 21, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Soo Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics component embedded PCB
- Patent number 8,618,421
- Issue date Dec 31, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jung-Soo Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB strip and manufacturing method for electronic component embedde...
- Patent number 8,482,890
- Issue date Jul 9, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Moon-il Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing capacitor-embedded PCB
- Patent number 8,302,270
- Issue date Nov 6, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board having embedded resis...
- Patent number 8,166,653
- Issue date May 1, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Hwa Sun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing capacitor-embedded PCB
- Patent number 7,886,414
- Issue date Feb 15, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing component-embedded printed circuit board
- Patent number 7,730,612
- Issue date Jun 8, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Hwa-Sun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board with built-in electronic com...
- Patent number 7,328,504
- Issue date Feb 12, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Seung Gu Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LED PACKAGE
- Publication number 20150348950
- Publication date Dec 3, 2015
- Research & Business Foundation Sungkyunkwan University
- Su-jeong SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE...
- Publication number 20150200343
- Publication date Jul 16, 2015
- Research & Business Foundation Sungkyunkwan University
- Su-jeong SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE HAVING THE...
- Publication number 20150179908
- Publication date Jun 25, 2015
- Research & Business Foundation Sungkyunkwan University
- Su Jeong SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE
- Publication number 20140123486
- Publication date May 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Soo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE HAVING THE...
- Publication number 20130037955
- Publication date Feb 14, 2013
- Su Jeong SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE FOR CAPACITOR-EMBEDDED PRINTED CI...
- Publication number 20120152886
- Publication date Jun 21, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB STRIP AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT EMBEDDE...
- Publication number 20110176246
- Publication date Jul 21, 2011
- Samsung Electro-Mechanics CO., LTD.
- Moon-il KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS COMPONENT EMBEDDED PCB
- Publication number 20110100689
- Publication date May 5, 2011
- Jung-Soo BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing capacitor-embedded PCB
- Publication number 20110099779
- Publication date May 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE
- Publication number 20110048780
- Publication date Mar 3, 2011
- Samsung Electro-Mechanics CO., LTD.
- Jin-Soo Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board having embedded resis...
- Publication number 20100269335
- Publication date Oct 28, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Hwa Sun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20100097770
- Publication date Apr 22, 2010
- Samsung Electro-Mechanics CO., LTD.
- Hwa-Sun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board including electronic component embedded there...
- Publication number 20090301766
- Publication date Dec 10, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Hwa Sun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate for capacitor-embedded printed circuit board, capacitor-e...
- Publication number 20090244864
- Publication date Oct 1, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing component-embedded printed circuit board
- Publication number 20090049686
- Publication date Feb 26, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Hwa-Sun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing capacitor-embedded PCB
- Publication number 20090025195
- Publication date Jan 29, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board having embedded resistors and method of manuf...
- Publication number 20080110669
- Publication date May 15, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Hwa Sun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing circuit board with built-in electronic com...
- Publication number 20070006456
- Publication date Jan 11, 2007
- Samsung Electro-Mechanics CO., LTD.
- Seung Gu Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hwa Sun Park

Person

Patents Grantslast 30 patents

Package of light emitting diode with heat sink

Substrate for semiconductor device, semiconductor device having the...

Substrate for semiconductor device, semiconductor device having the...

Method of processing cavity of core substrate

Electronics component embedded PCB

PCB strip and manufacturing method for electronic component embedde...

Method of manufacturing capacitor-embedded PCB

Method of manufacturing printed circuit board having embedded resis...

Method of manufacturing capacitor-embedded PCB

Method of manufacturing component-embedded printed circuit board

Method for manufacturing circuit board with built-in electronic com...

Patents Applicationslast 30 patents

LED PACKAGE

SUBSTRATE FOR LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE...

SUBSTRATE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE HAVING THE...

METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE

SUBSTRATE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE HAVING THE...

METHOD OF MANUFACTURING SUBSTRATE FOR CAPACITOR-EMBEDDED PRINTED CI...

PCB STRIP AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT EMBEDDE...

ELECTRONICS COMPONENT EMBEDDED PCB

Method of manufacturing capacitor-embedded PCB

METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE

Method of manufacturing printed circuit board having embedded resis...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Printed circuit board including electronic component embedded there...

Substrate for capacitor-embedded printed circuit board, capacitor-e...

Method of manufacturing component-embedded printed circuit board

Method of manufacturing capacitor-embedded PCB

Printed circuit board having embedded resistors and method of manuf...

Method for manufacturing circuit board with built-in electronic com...