HWAIL JIN

Person

SEONGNAM-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,074,142
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jongpa Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing tape and method of fabricating a semiconductor device us...
- Patent number 12,040,213
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hwail Jin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package with curing layer between semiconductor chips
- Patent number 11,842,982
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Seon Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding method
- Patent number 10,910,339
- Issue date Feb 2, 2021
- Samsung Electronics Co., Ltd.
- Hwail Jin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240371835
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE US...
- Publication number 20240312826
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- HWAIL JIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION AND WAFER PROCESSING TAPE INCLUDING THE SAME
- Publication number 20230212440
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- CHEONIL PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230109292
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hwail JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING GAS BLOWING AGENT
- Publication number 20230087718
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Cheonil PARK
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220406755
- Publication date Dec 22, 2022
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220139873
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Seon Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE US...
- Publication number 20220020627
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- HWAIL JIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLIP CHIP BONDING METHOD
- Publication number 20200058615
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- HWAIL JIN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package and method of fabricating the same

Processing tape and method of fabricating a semiconductor device us...

Semiconductor package with curing layer between semiconductor chips

Flip chip bonding method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE US...

ADHESIVE COMPOSITION AND WAFER PROCESSING TAPE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING GAS BLOWING AGENT

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE US...

FLIP CHIP BONDING METHOD