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Asan-si, KR
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Patents Grants
last 30 patents
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Patent Grant
Apparatus to manufacture a semiconductor package having a buffer di...
Patent number
8,156,636
Issue date
Apr 17, 2012
Samsung Electronics Co., Ltd.
Goon Woo Kim
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
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Patent Grant
Method of forming at least one bonding structure
Patent number
8,053,351
Issue date
Nov 8, 2011
Samsung Electronics Co., Ltd.
Hwang-Bok Ryu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PRINTED CIRCUIT BOARD AND MEMORY MODULE COMPRISING THE SAME
Publication number
20130223001
Publication date
Aug 29, 2013
Samsung Electronics Co., Ltd.
Hwang-bok Ryu
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
METHOD OF FORMING AT LEAST ONE BONDING STRUCTURE
Publication number
20110136334
Publication date
Jun 9, 2011
Samsung Electronics Co., Ltd.
Hwang-Bok Ryu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
Publication number
20100071854
Publication date
Mar 25, 2010
Samsung Electronics Co., Ltd.
Goon Woo KIM
H01 - BASIC ELECTRIC ELEMENTS