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Hwanpil PARK
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Hwaseong-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package structure and fabrication method thereof
Patent number
11,842,941
Issue date
Dec 12, 2023
Samsung Electronics Co., Ltd.
Youngho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and a package-on-package including the same
Patent number
11,776,913
Issue date
Oct 3, 2023
Samsung Electronics Co., Ltd.
Hwanpil Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages having a dam structure
Patent number
11,437,293
Issue date
Sep 6, 2022
Samsung Electronics Co., Ltd.
Dongho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and fabrication method thereof
Patent number
11,315,851
Issue date
Apr 26, 2022
Samsung Electronics Co., Ltd.
Youngho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and fabrication method thereof
Patent number
10,847,435
Issue date
Nov 24, 2020
Samsung Electronics Co., Ltd.
Youngho Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20240079288
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
Youngho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING A PACKAGE SUBSTRATE AND METHOD FOR MA...
Publication number
20230110126
Publication date
Apr 13, 2023
Samsung Electronics Co., Ltd.
JEONGHYUN LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230114274
Publication date
Apr 13, 2023
Samsung Electronics Co., Ltd.
Jeonghyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE
Publication number
20220384291
Publication date
Dec 1, 2022
Samsung Electronics Co., Ltd.
Dongho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20220384320
Publication date
Dec 1, 2022
Samsung Electronics Co., Ltd.
Jeonghyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20220216121
Publication date
Jul 7, 2022
Samsung Electronics Co., Ltd.
Youngho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND A PACKAGE-ON-PACKAGE INCLUDING THE SAME
Publication number
20210407911
Publication date
Dec 30, 2021
Samsung Electronics Co., Ltd.
Hwanpil PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE
Publication number
20210242101
Publication date
Aug 5, 2021
Samsung Electronics Co., Ltd.
Dongho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20210082783
Publication date
Mar 18, 2021
Samsung Electronics Co., Ltd.
Youngho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20180240729
Publication date
Aug 23, 2018
Samsung Electronics Co., Ltd.
Youngho KIM
H01 - BASIC ELECTRIC ELEMENTS