Hwanpil PARK

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages having a dam structure
- Patent number 12,261,093
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,033,924
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 11,842,941
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a package-on-package including the same
- Patent number 11,776,913
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Hwanpil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a dam structure
- Patent number 11,437,293
- Issue date Sep 6, 2022
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 11,315,851
- Issue date Apr 26, 2022
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 10,847,435
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321701
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240079288
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Youngho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING A PACKAGE SUBSTRATE AND METHOD FOR MA...
- Publication number 20230110126
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- JEONGHYUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230114274
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Jeonghyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE
- Publication number 20220384291
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Dongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220384320
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Jeonghyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20220216121
- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Youngho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A PACKAGE-ON-PACKAGE INCLUDING THE SAME
- Publication number 20210407911
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Hwanpil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE
- Publication number 20210242101
- Publication date Aug 5, 2021
- Samsung Electronics Co., Ltd.
- Dongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20210082783
- Publication date Mar 18, 2021
- Samsung Electronics Co., Ltd.
- Youngho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20180240729
- Publication date Aug 23, 2018
- Samsung Electronics Co., Ltd.
- Youngho KIM
- H01 - BASIC ELECTRIC ELEMENTS

Hwanpil PARK

Person

Patents Grantslast 30 patents

Semiconductor packages having a dam structure

Semiconductor package structure and fabrication method thereof

Semiconductor package

Semiconductor package structure and fabrication method thereof

Semiconductor package and a package-on-package including the same

Semiconductor packages having a dam structure

Semiconductor package structure and fabrication method thereof

Semiconductor package structure and fabrication method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGES HAVING A PACKAGE SUBSTRATE AND METHOD FOR MA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND A PACKAGE-ON-PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF