Hwanyoung CHOI

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Chip-stacked semiconductor package with increased package reliability
- Patent number 11,756,935
- Issue date Sep 12, 2023
- Samsung Electronics Co., Ltd.
- Insup Shin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170440
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Hwanyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240120263
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- CHEOL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063103
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063129
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Seok Geun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...
- Publication number 20240014086
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014117
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Seok Geun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP
- Publication number 20220278010
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Hyeongmun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE WITH INCREASED PACKAGE RELIABILITY
- Publication number 20210398947
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Insup SHIN
- H01 - BASIC ELECTRIC ELEMENTS

Hwanyoung CHOI

Person

Patents Grantslast 30 patents

Chip-stacked semiconductor package with increased package reliability

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP

CHIP-STACKED SEMICONDUCTOR PACKAGE WITH INCREASED PACKAGE RELIABILITY