Hway-Chi Lin

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for determining electro-migration failure mode
- Patent number 7,449,911
- Issue date Nov 11, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Lung Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Device structure having enhanced surface adhesion and failure mode...
- Patent number 7,157,367
- Issue date Jan 2, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hway Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rule to determine CMP polish time
- Patent number 6,514,673
- Issue date Feb 4, 2003
- Taiwan Semiconductor Manufacturing Company
- Hway-Chi Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Three-dimensional type inductor for mixed mode radio frequency device
- Patent number 6,291,872
- Issue date Sep 18, 2001
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Lang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rule to determine CMP polish time
- Patent number 6,232,043
- Issue date May 15, 2001
- Taiwan Semiconductor Manufacturing Company
- Hway-Chi Lin
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DETERMINING ELECTRO-MIGRATION FAILURE MODE
- Publication number 20080184805
- Publication date Aug 7, 2008
- Yi-Lung Cheng
- G01 - MEASURING TESTING
Information Patent Application
Novel device structure having enhanced surface adhesion and failure...
- Publication number 20050272260
- Publication date Dec 8, 2005
- Taiwan Semiconductor Manufacturing Co.
- Hway Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel method to deposit carbon doped SiO2 films with improved film...
- Publication number 20050124151
- Publication date Jun 9, 2005
- Taiwan Semiconductor Manufacturing Co.
- Yi-Lung Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Rule to determine CMP polish time
- Publication number 20020090745
- Publication date Jul 11, 2002
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Hway-Chi Lin
- B24 - GRINDING POLISHING