Hwee Hong Chew

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with buffer layer
- Patent number 11,990,353
- Issue date May 21, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with via openings and methods of making th...
- Patent number 11,990,431
- Issue date May 21, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging chip and chip package structure
- Patent number 11,881,415
- Issue date Jan 23, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for prevention of adhesion of marine organisms to...
- Patent number 11,390,961
- Issue date Jul 19, 2022
- SEMBCORP MARINE REPAIRS & UPGRADES PTE. LTD.
- Hwee Hong Chew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of packaging chip and chip package structure
- Patent number 11,049,734
- Issue date Jun 29, 2021
- PEP INNOVATION PTE. LTD.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for applying superimposed time-varying frequency...
- Patent number 10,858,268
- Issue date Dec 8, 2020
- Semb-Eco R&D PTE LTD
- Hwee Hong Chew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for applying superimposed time-varying frequency...
- Patent number 10,807,886
- Issue date Oct 20, 2020
- Semb-Eco R&D PTE LTD
- Hwee Hong Chew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of packaging chip and chip package structure
- Patent number 10,615,056
- Issue date Apr 7, 2020
- Pep Innovation PTE Ltd.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for applying superimposed time-varying frequency...
- Patent number 10,561,986
- Issue date Feb 18, 2020
- Semb-Eco R&D PTE LTD
- Hwee Hong Chew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for applying superimposed time-varying frequency...
- Patent number 10,532,318
- Issue date Jan 14, 2020
- Semb-Eco R&D PTE LTD
- Hwee Hong Chew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for applying superimposed time-varying frequency...
- Patent number 10,500,542
- Issue date Dec 10, 2019
- Semb-Eco R&D PTE LTD
- Hwee Hong Chew
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
System and method for providing corrosion protection of metallic st...
- Patent number 10,494,723
- Issue date Dec 3, 2019
- SEMBCORP MARINE REPAIRS & UPGRADES PTE. LTD.
- Hwee Hong Chew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method of ballast water treatment with continuous biofou...
- Patent number 10,457,570
- Issue date Oct 29, 2019
- SEMBCORP MARINE REPAIRS & UPGRADES PTE. LTD.
- Sow Hong Kuik
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Multi-layer substrate for semiconductor packaging
- Patent number 10,446,457
- Issue date Oct 15, 2019
- Advanpack Solutions PTE LTD
- Shoa Siong Lim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of packaging chip and chip package structure
- Patent number 10,431,477
- Issue date Oct 1, 2019
- Pep Innovation PTE Ltd.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for prevention of adhesion of organisms in water...
- Patent number 10,227,243
- Issue date Mar 12, 2019
- Ecospec Global Technology Pte. Ltd.
- Hwee Hong Chew
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,154,588
- Issue date Dec 11, 2018
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer substrate for semiconductor packaging
- Patent number 10,049,950
- Issue date Aug 14, 2018
- Advanpack Solutions PTE LTD
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package substrate and package manufacturing...
- Patent number 9,892,916
- Issue date Feb 13, 2018
- Advanpack Solutions PTE LTD
- Shoa-Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 9,754,899
- Issue date Sep 5, 2017
- Advanpack Solutions PTE LTD
- Shoa Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor package device, and manufacturin...
- Patent number 9,723,717
- Issue date Aug 1, 2017
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electrode for electrolytically producing alkaline water,...
- Patent number 9,689,079
- Issue date Jun 27, 2017
- Ecospec Global Technology Pte. Ltd.
- Hwee Hong Chew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing method of substrate structure having embedded interco...
- Patent number 9,653,323
- Issue date May 16, 2017
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package
- Patent number 9,583,449
- Issue date Feb 28, 2017
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for carbonizing carbon dioxide and application thereof
- Patent number 9,469,539
- Issue date Oct 18, 2016
- Ecospec Global Technology Pte. Ltd.
- Hwee Hong Chew
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device carrier for fine pitch packaging miniaturizati...
- Patent number 9,396,982
- Issue date Jul 19, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier, package carrier manufacturing method, package stru...
- Patent number 9,379,044
- Issue date Jun 28, 2016
- Advanpack Solutions PTE LTD
- Shoa-Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and manufacturing method thereof
- Patent number 9,362,206
- Issue date Jun 7, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of forming an etch-back type semiconductor pac...
- Patent number 9,305,868
- Issue date Apr 5, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor package device, and manufacturin...
- Patent number 9,301,391
- Issue date Mar 29, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND THE STRUCTURE FORMED THEREFROM
- Publication number 20240258260
- Publication date Aug 1, 2024
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR TREATING LIQUID BEVERAGE USING ELECTROMAGNETI...
- Publication number 20230404116
- Publication date Dec 21, 2023
- ECOSPEC NOVELTECH PTE LTD
- Hwee Hong CHEW
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Application
METHOD FOR DETERMINING ANTIOXIDANT CAPACITY IN BEVERAGES
- Publication number 20230341364
- Publication date Oct 26, 2023
- ECOSPEC NOVELTECH PTE LTD
- Hwee Hong CHEW
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH VIA OPENINGS AND METHODS OF MAKING TH...
- Publication number 20220157750
- Publication date May 19, 2022
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...
- Publication number 20220102189
- Publication date Mar 31, 2022
- PYXIS CF PTE. LTD.
- HWEE SENG CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP STRUCTURE
- Publication number 20220102254
- Publication date Mar 31, 2022
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUFFER LAYER
- Publication number 20210343549
- Publication date Nov 4, 2021
- PEP INNOVATION PTE LTD.
- Hwee Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE
- Publication number 20210305064
- Publication date Sep 30, 2021
- Hwee Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE
- Publication number 20190371626
- Publication date Dec 5, 2019
- Hwee Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Substrate For Semiconductor Packaging
- Publication number 20180323121
- Publication date Nov 8, 2018
- Advanpack Solutions Pte Ltd
- Shoa Siong LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR APPLYING SUPERIMPOSED TIME-VARYING FREQUENCY...
- Publication number 20180221821
- Publication date Aug 9, 2018
- SEMB-ECO R&D PTE LTD
- Hwee Hong CHEW
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD AND SYSTEM FOR APPLYING SUPERIMPOSED TIME-VARYING FREQUENCY...
- Publication number 20180222777
- Publication date Aug 9, 2018
- SEMB-ECO R&D PTE LTD
- Hwee Hong CHEW
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND SYSTEM FOR APPLYING SUPERIMPOSED TIME-VARYING FREQUENCY...
- Publication number 20180222778
- Publication date Aug 9, 2018
- SEMB-ECO R&D PTE LTD
- Hwee Hong CHEW
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
METHOD AND SYSTEM FOR APPLYING SUPERIMPOSED TIME-VARYING FREQUENCY...
- Publication number 20180216246
- Publication date Aug 2, 2018
- SEMB-ECO R&D PTE LTD
- Hwee Hong CHEW
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND SYSTEM FOR APPLYING SUPERIMPOSED TIME-VARYING FREQUENCY...
- Publication number 20180201526
- Publication date Jul 19, 2018
- SEMB-ECO R&D PTE LTD
- Hwee Hong CHEW
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THEREOF
- Publication number 20180204741
- Publication date Jul 19, 2018
- PEP INNOVATION PTE LTD.
- Hwee Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR 3D STACKING AND METHOD OF FORMING THEREOF
- Publication number 20180151392
- Publication date May 31, 2018
- PEP INNOVATION PTE LTD.
- Hwee Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE
- Publication number 20180151393
- Publication date May 31, 2018
- PEP INNOVATION PTE LTD.
- Hwee Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly and Method of Fabricating a Semiconductor St...
- Publication number 20170330842
- Publication date Nov 16, 2017
- Advanpack Solutions Pte Ltd
- Shoa Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170303399
- Publication date Oct 19, 2017
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160329306
- Publication date Nov 10, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PREVENTION OF ADHESION OF MARINE ORGANISMS TO...
- Publication number 20160298257
- Publication date Oct 13, 2016
- ECOSPEC GLOBAL TECHNOLOGY PTE LTD.
- Hwee Hong Chew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGE SUBSTRATE AND PACKAGE MANUFACTURING...
- Publication number 20160293416
- Publication date Oct 6, 2016
- Advanpack Solutions Pte Ltd
- Shoa-Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20160268225
- Publication date Sep 15, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SUBSTRATE STRUCTURE
- Publication number 20160189981
- Publication date Jun 30, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160118349
- Publication date Apr 28, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Fabricating the Same
- Publication number 20160013139
- Publication date Jan 14, 2016
- Advanpack Solutions Pte Ltd
- Shoa Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PREVENTION OF ADHESION OF ORGANISMS IN WATER...
- Publication number 20150232352
- Publication date Aug 20, 2015
- ECOSPEC GLOBAL TECHNOLOGY PTE LTD.
- Hwee Hong Chew
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
SYSTEM AND METHOD FOR PROVIDING CORROSION PROTECTION OF METALLIC ST...
- Publication number 20150218712
- Publication date Aug 6, 2015
- ECOSPEC GLOBAL TECHNOLOGY PTE LTD.
- Hwee Hong Chew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD OF BALLAST WATER TREATMENT WITH CONTINUOUS BIOFOU...
- Publication number 20150183663
- Publication date Jul 2, 2015
- Sembawang Shipyard Pte Ltd
- Sow Hong Kuik
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE

Hwee Hong Chew

Person

Patents Grantslast 30 patents

Semiconductor device with buffer layer

Semiconductor structures with via openings and methods of making th...

Method of packaging chip and chip package structure

System and method for prevention of adhesion of marine organisms to...

Method of packaging chip and chip package structure

Method and system for applying superimposed time-varying frequency...

Method and system for applying superimposed time-varying frequency...

Method of packaging chip and chip package structure

Method and system for applying superimposed time-varying frequency...

Method and system for applying superimposed time-varying frequency...

Method and system for applying superimposed time-varying frequency...

System and method for providing corrosion protection of metallic st...

System and method of ballast water treatment with continuous biofou...

Multi-layer substrate for semiconductor packaging

Method of packaging chip and chip package structure

System and method for prevention of adhesion of organisms in water...

Manufacturing method of semiconductor package

Multi-layer substrate for semiconductor packaging

Manufacturing method of package substrate and package manufacturing...

Semiconductor structure and method of fabricating the same

Substrate structure, semiconductor package device, and manufacturin...

Composite electrode for electrolytically producing alkaline water,...

Manufacturing method of substrate structure having embedded interco...

Semiconductor package

Method for carbonizing carbon dioxide and application thereof

Semiconductor device carrier for fine pitch packaging miniaturizati...

Package carrier, package carrier manufacturing method, package stru...

Chip and manufacturing method thereof

Manufacturing method of forming an etch-back type semiconductor pac...

Substrate structure, semiconductor package device, and manufacturin...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING METHOD AND THE STRUCTURE FORMED THEREFROM

SYSTEM AND METHOD FOR TREATING LIQUID BEVERAGE USING ELECTROMAGNETI...

METHOD FOR DETERMINING ANTIOXIDANT CAPACITY IN BEVERAGES

SEMICONDUCTOR STRUCTURES WITH VIA OPENINGS AND METHODS OF MAKING TH...

APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...

CHIP PACKAGING METHOD AND CHIP STRUCTURE

SEMICONDUCTOR DEVICE WITH BUFFER LAYER

METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE

METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE

Multi-Layer Substrate For Semiconductor Packaging

METHOD AND SYSTEM FOR APPLYING SUPERIMPOSED TIME-VARYING FREQUENCY...

METHOD AND SYSTEM FOR APPLYING SUPERIMPOSED TIME-VARYING FREQUENCY...

METHOD AND SYSTEM FOR APPLYING SUPERIMPOSED TIME-VARYING FREQUENCY...

METHOD AND SYSTEM FOR APPLYING SUPERIMPOSED TIME-VARYING FREQUENCY...

METHOD AND SYSTEM FOR APPLYING SUPERIMPOSED TIME-VARYING FREQUENCY...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR PACKAGE FOR 3D STACKING AND METHOD OF FORMING THEREOF

METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE

Semiconductor Assembly and Method of Fabricating a Semiconductor St...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SYSTEM AND METHOD FOR PREVENTION OF ADHESION OF MARINE ORGANISMS TO...

MANUFACTURING METHOD OF PACKAGE SUBSTRATE AND PACKAGE MANUFACTURING...

CHIP AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SUBSTRATE STRUCTURE

SEMICONDUCTOR PACKAGE

Semiconductor Structure and Method of Fabricating the Same

SYSTEM AND METHOD FOR PREVENTION OF ADHESION OF ORGANISMS IN WATER...

SYSTEM AND METHOD FOR PROVIDING CORROSION PROTECTION OF METALLIC ST...

SYSTEM AND METHOD OF BALLAST WATER TREATMENT WITH CONTINUOUS BIOFOU...