Hwei-Jay CHU

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,165,920
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hwei-Jay Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
- Patent number 11,830,910
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chieh-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,676,862
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hwei-Jay Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,393,718
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hwei-Jay Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a conductive paste
- Patent number 9,390,832
- Issue date Jul 12, 2016
- National Tsing Hua University
- Nyan-Hwa Tai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240379437
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING TH...
- Publication number 20240266212
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240021472
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTS WITH LOWER CONTACT RES...
- Publication number 20230387022
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20230378255
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Han WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CARBON-...
- Publication number 20230230881
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230062825
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20230062416
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Han WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230039661
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20220277995
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210242078
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A CONDUCTIVE PASTE
- Publication number 20140158948
- Publication date Jun 12, 2014
- National Tsing Hua University
- Nyan-Hwa TAI
- H01 - BASIC ELECTRIC ELEMENTS

Hwei-Jay CHU

Person

Patents Grantslast 30 patents

Semiconductor structure and method for forming the same

Semiconductor structure having air gaps and method for manufacturin...

Semiconductor device structure and methods of forming the same

Semiconductor structure and method for forming the same

Method for fabricating a conductive paste

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING TH...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTS WITH LOWER CONTACT RES...

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CARBON-...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD FOR FABRICATING A CONDUCTIVE PASTE