Hyein YOO

Person

Pyeongtaek-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film, semiconductor apparatus using the same, and semicond...
- Patent number 11,355,413
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device having stacked semiconductor chips and method...
- Patent number 10,923,465
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Won-Gi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked semiconductor chips and method...
- Patent number 10,354,985
- Issue date Jul 16, 2019
- Samsung Electronics Co., Ltd.
- Won-Gi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having mold layer with curved corner and meth...
- Patent number 10,147,713
- Issue date Dec 4, 2018
- Samsung Electronics Co., Ltd.
- Hyein Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a fan-out panel level package and a carrier t...
- Patent number 10,115,613
- Issue date Oct 30, 2018
- Samsung Electronics Co., Ltd.
- Won-Gi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package having mold layer wit...
- Patent number 9,929,131
- Issue date Mar 27, 2018
- Samsung Electronics Co., Ltd.
- Hyein Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL CONDUCTIVE FILM
- Publication number 20220246491
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM, SEMICONDUCTOR APPARATUS USING THE SAME, AND SEMICOND...
- Publication number 20200211920
- Publication date Jul 2, 2020
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20190273075
- Publication date Sep 5, 2019
- Samsung Electronics Co., Ltd.
- WON-GI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME
- Publication number 20180158810
- Publication date Jun 7, 2018
- Samsung Electronics Co., Ltd.
- Hyein YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20170365591
- Publication date Dec 21, 2017
- Samsung Electronics Co., Ltd.
- WON-GI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A FAN-OUT PANEL LEVEL PACKAGE AND A CARRIER T...
- Publication number 20170358467
- Publication date Dec 14, 2017
- Samsung Electronics Co., Ltd.
- Won-Gi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20170358535
- Publication date Dec 14, 2017
- Hyein YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20170179098
- Publication date Jun 22, 2017
- Samsung Electronics Co., Ltd.
- Hyein YOO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermal conductive film

Adhesive film, semiconductor apparatus using the same, and semicond...

Semiconductor device having stacked semiconductor chips and method...

Semiconductor device having stacked semiconductor chips and method...

Semiconductor package having mold layer with curved corner and meth...

Method of fabricating a fan-out panel level package and a carrier t...

Method of fabricating a semiconductor package having mold layer wit...

Patents Applicationslast 30 patents

THERMAL CONDUCTIVE FILM

ADHESIVE FILM, SEMICONDUCTOR APPARATUS USING THE SAME, AND SEMICOND...

SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...

METHOD OF FABRICATING A FAN-OUT PANEL LEVEL PACKAGE AND A CARRIER T...

SEMICONDUCTOR PACKAGES

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE