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Hyeog Chan Kwon
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Singapore, SG
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last 30 patents
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Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING
Publication number
20070158806
Publication date
Jul 12, 2007
STATS ChipPAC Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING STACKED DIE
Publication number
20070158833
Publication date
Jul 12, 2007
Soo-San Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER SCALE HEAT SLUG SYSTEM
Publication number
20070109749
Publication date
May 17, 2007
STATS ChipPAC Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PLANAR INTERCONNECTS
Publication number
20070063331
Publication date
Mar 22, 2007
STATS ChipPAC Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS