Hyeok-Sang Oh

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,600,569
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Su-Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,049,810
- Issue date Jun 29, 2021
- Samsung Electronics Co., Ltd.
- Su-Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming micropatterns and substrate processing apparatus
- Patent number 10,916,437
- Issue date Feb 9, 2021
- Samsung Electronics Co., Ltd.
- Sang-Shin Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,847,454
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,535,600
- Issue date Jan 14, 2020
- Samsung Electronics Co., Ltd.
- Hoon Seok Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,510,658
- Issue date Dec 17, 2019
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 10,497,649
- Issue date Dec 3, 2019
- Samsung Electronics Co., Ltd.
- Su-Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,475,739
- Issue date Nov 12, 2019
- Samsung Electronics Co., Ltd.
- Woo Kyung You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via plug and method of forming the same
- Patent number 10,461,027
- Issue date Oct 29, 2019
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 10,276,505
- Issue date Apr 30, 2019
- Samsung Electronics Co., Ltd.
- Young-Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structures and semiconductor devices
- Patent number 10,229,876
- Issue date Mar 12, 2019
- Samsung Electronics Co., Ltd.
- Jun-Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit devices having damascene inte...
- Patent number 8,373,273
- Issue date Feb 12, 2013
- Samsung Electronics Co., Ltd.
- Hyeok-Sang Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit devices having damascene inte...
- Patent number 8,232,200
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Hyeok-Sang Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor device having slope at lower s...
- Patent number 7,534,720
- Issue date May 19, 2009
- Samsung Electronics Co., Ltd.
- Ki-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating dual damascene interconnection
- Patent number 7,176,126
- Issue date Feb 13, 2007
- Samsung Electronics, Co., Ltd.
- Hyeok-sang Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor device having slope at lower s...
- Patent number 7,163,890
- Issue date Jan 16, 2007
- Samsung Electronics Co., Ltd.
- Ki-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210233860
- Publication date Jul 29, 2021
- Samsung Electronics Co., Ltd.
- SU-HYUN BARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20200118926
- Publication date Apr 16, 2020
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190311992
- Publication date Oct 10, 2019
- Samsung Electronics Co., Ltd.
- SU-HYUN BARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190304903
- Publication date Oct 3, 2019
- Samsung Electronics Co., Ltd.
- Woo Kyung YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VIA PLUG AND METHOD OF FORMING THE SAME
- Publication number 20190244896
- Publication date Aug 8, 2019
- Samsung Electronics Co., Ltd.
- Eui Bok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Micropatterns and Substrate Processing Apparatus
- Publication number 20190198342
- Publication date Jun 27, 2019
- Samsung Electronics Co., Ltd.
- SANG-SHIN JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190181088
- Publication date Jun 13, 2019
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190148289
- Publication date May 16, 2019
- Samsung Electronics Co., Ltd.
- Hoon Seok SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190043803
- Publication date Feb 7, 2019
- Samsung Electronics Co., Ltd.
- Woo Kyung YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180261544
- Publication date Sep 13, 2018
- Samsung Electronics Co., Ltd.
- YOUNG-BAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180261546
- Publication date Sep 13, 2018
- Samsung Electronics Co., Ltd.
- SU-HYUN BARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURES AND SEMICONDUCTOR DEVICES
- Publication number 20160343660
- Publication date Nov 24, 2016
- Jun-Jung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT DEVICES HAVING DAMASCENE INTE...
- Publication number 20120267785
- Publication date Oct 25, 2012
- Hyeok-Sang Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICE HAVING SLOPE AT LOWER S...
- Publication number 20070082484
- Publication date Apr 12, 2007
- Ki-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image device and method of fabricating the same
- Publication number 20060049439
- Publication date Mar 9, 2006
- Samsung Electronics Co., Ltd.
- Hyeok-Sang Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming metal interconnect of semiconductor device
- Publication number 20060024941
- Publication date Feb 2, 2006
- SAMSUNG ELECTRONICS CO., LTD.
- Jeong-hoon Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating dual damascene interconnection
- Publication number 20060024948
- Publication date Feb 2, 2006
- SAMSUNG ELECTRONICS CO., LTD.
- Hyeok-sang Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating semiconductor device having slope at lower s...
- Publication number 20050054192
- Publication date Mar 10, 2005
- SAMSUNG ELECTRONICS CO., LTD.
- Ki-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS

Hyeok-Sang Oh

Person

Patents Grantslast 30 patents

Integrated circuit device and method of manufacturing the same

Integrated circuit device and method of manufacturing the same

Methods of forming micropatterns and substrate processing apparatus

Semiconductor devices

Semiconductor device

Semiconductor devices

Integrated circuit device and method of manufacturing the same

Semiconductor device

Semiconductor device including via plug and method of forming the same

Integrated circuit device and method of manufacturing the same

Wiring structures and semiconductor devices

Methods of forming integrated circuit devices having damascene inte...

Methods of forming integrated circuit devices having damascene inte...

Methods of fabricating semiconductor device having slope at lower s...

Method of fabricating dual damascene interconnection

Methods of fabricating semiconductor device having slope at lower s...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING VIA PLUG AND METHOD OF FORMING THE SAME

Methods of Forming Micropatterns and Substrate Processing Apparatus

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRING STRUCTURES AND SEMICONDUCTOR DEVICES

METHODS OF FORMING INTEGRATED CIRCUIT DEVICES HAVING DAMASCENE INTE...

METHODS OF FABRICATING SEMICONDUCTOR DEVICE HAVING SLOPE AT LOWER S...

Image device and method of fabricating the same

Method of forming metal interconnect of semiconductor device

Method of fabricating dual damascene interconnection

Methods of fabricating semiconductor device having slope at lower s...