Hyeong No Kim

Person

Paju-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package
- Patent number 8,866,280
- Issue date Oct 21, 2014
- Advanced Semiconductor Engineering, Inc.
- Soo-Min Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked type chip package structure
- Patent number 7,964,953
- Issue date Jun 21, 2011
- Advanced Semiconductor Engineering, Inc.
- Hyeong-No Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid carrier and a method for making the same
- Patent number 7,939,379
- Issue date May 10, 2011
- Advanced Semiconductor Engineering, Inc.
- Sung-Ho Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and fabricating method thereof
- Patent number 7,830,024
- Issue date Nov 9, 2010
- Advanced Semiconductor Engineering, Inc.
- Hyeong-No Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked type chip package structure
- Patent number 7,701,046
- Issue date Apr 20, 2010
- Advanced Semiconductor Engineering Inc.
- Hyeong-No Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation method used in leadless packaging process
- Patent number 7,205,658
- Issue date Apr 17, 2007
- Advanced Semiconductor Engineering, Inc.
- Jun Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation method used in leadless packaging process
- Patent number 6,773,961
- Issue date Aug 10, 2004
- Advanced Semiconductor Engineering Inc.
- Jun Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE
- Publication number 20140346654
- Publication date Nov 27, 2014
- Advanced Semiconductor Engineering, Inc.
- SOO-MIN CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TYPE CHIP PACKAGE STRUCTURE
- Publication number 20100096740
- Publication date Apr 22, 2010
- Advanced Semiconductor Engineering, Inc.
- Hyeong-No Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package and fabricating method thereof
- Publication number 20100084772
- Publication date Apr 8, 2010
- Advanced Semiconductor Engineering, Inc.
- Hyeong-No Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20090261470
- Publication date Oct 22, 2009
- Advanced Semiconductor Engineering, Inc.
- SOO-MIN CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CARRIER AND A METHOD FOR MAKING THE SAME
- Publication number 20090194858
- Publication date Aug 6, 2009
- Advanced Semiconductor Engineering, Inc.
- Sung-Ho Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TYPE CHIP PACKAGE STRUCTURE
- Publication number 20080158844
- Publication date Jul 3, 2008
- Advanced Semiconductor Engineering, Inc.
- Hyeong-No Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATING PROCESS THEREOF
- Publication number 20080128890
- Publication date Jun 5, 2008
- Advanced Semiconductor Engineering, Inc.
- SOO-MIN CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process and lead frame for making leadless semiconductor packages
- Publication number 20060033184
- Publication date Feb 16, 2006
- Hyung Jun Park
- H01 - BASIC ELECTRIC ELEMENTS

Hyeong No Kim

Person

Patents Grantslast 30 patents

Chip package

Stacked type chip package structure

Hybrid carrier and a method for making the same

Package and fabricating method thereof

Stacked type chip package structure

Singulation method used in leadless packaging process

Singulation method used in leadless packaging process

Patents Applicationslast 30 patents

CHIP PACKAGE

STACKED TYPE CHIP PACKAGE STRUCTURE

Package and fabricating method thereof

CHIP PACKAGE

HYBRID CARRIER AND A METHOD FOR MAKING THE SAME

STACKED TYPE CHIP PACKAGE STRUCTURE

CHIP PACKAGE AND FABRICATING PROCESS THEREOF

Process and lead frame for making leadless semiconductor packages