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Seoul, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Chip-stacked semiconductor package with increased package reliability
Patent number
11,756,935
Issue date
Sep 12, 2023
Samsung Electronics Co., Ltd.
Insup Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,721,601
Issue date
Aug 8, 2023
Samsung Electronics Co., Ltd.
Hyeongmun Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,658,160
Issue date
May 23, 2023
Samsung Electronics Co., Ltd.
Hyeonjun Song
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with chip end design and trenches to control...
Patent number
11,469,099
Issue date
Oct 11, 2022
Samsung Electronics Co., Ltd.
Jungmin Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,257,794
Issue date
Feb 22, 2022
Samsung Electronics Co., Ltd.
Hyeonjun Song
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including test bumps
Patent number
11,257,725
Issue date
Feb 22, 2022
Samsung Electronics Co., Ltd.
Taehyeong Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
9,035,308
Issue date
May 19, 2015
Samsung Electronics Co., Ltd.
Choongbin Yim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CARRIER STRUCTURE INCLUDING POCKETS FOR ACCOMMODATING SEMICONDUCTOR...
Publication number
20220367367
Publication date
Nov 17, 2022
Samsung Electronics Co., Ltd.
Hyeongmun KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP
Publication number
20220278010
Publication date
Sep 1, 2022
Samsung Electronics Co., Ltd.
Hyeongmun Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS
Publication number
20220148994
Publication date
May 12, 2022
Samsung Electronics Co., Ltd.
Taehyeong KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220139881
Publication date
May 5, 2022
Samsung Electronics Co., Ltd.
Hyeonjun SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE WITH INCREASED PACKAGE RELIABILITY
Publication number
20210398947
Publication date
Dec 23, 2021
Samsung Electronics Co., Ltd.
Insup SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20210265315
Publication date
Aug 26, 2021
Samsung Electronics Co., Ltd.
Hyeonjun SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20210210397
Publication date
Jul 8, 2021
Samsung Electronics Co., Ltd.
HYEONGMUN KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS
Publication number
20210175134
Publication date
Jun 10, 2021
Samsung Electronics Co., Ltd.
Taehyeong KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20210143008
Publication date
May 13, 2021
Samsung Electronics Co., Ltd.
Jungmin Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20140374883
Publication date
Dec 25, 2014
Samsung Electronics Co., Ltd.
CHOONGBIN YIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
Publication number
20140103517
Publication date
Apr 17, 2014
Samsung Electronics Co., Ltd.
Sung-Kyu PARK
H01 - BASIC ELECTRIC ELEMENTS