HYEONJEONG HWANG

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including under bump metallization pad
- Patent number 12,040,264
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple redistribution substrates
- Patent number 12,015,018
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package including glass substrate and a plurality of r...
- Patent number 11,955,499
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple redistribution substrates
- Patent number 11,538,798
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355798
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD
- Publication number 20240347435
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240243110
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203961
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240194641
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Chi Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240178114
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240178185
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- DONGKYU KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240145396
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sehoon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240145375
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
- Publication number 20240136250
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Yeonho Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128145
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONSEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120280
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120286
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113001
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Kyounglim SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096773
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECT...
- Publication number 20240071894
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240065003
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240047324
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240038642
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230361017
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230141318
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230109448
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230105942
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230101149
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- TAEWON YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Multiple Redistribution Substrates
- Publication number 20230085930
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PATTERN
- Publication number 20230019311
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- MINJUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220415771
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220375829
- Publication date Nov 24, 2022
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION SUBSTRATE AND METHOD...
- Publication number 20220367403
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Seokhyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220328389
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS

HYEONJEONG HWANG

Person

Patents Grantslast 30 patents

Semiconductor package including under bump metallization pad

Semiconductor package with multiple redistribution substrates

Image sensor package including glass substrate and a plurality of r...

Semiconductor package with multiple redistribution substrates

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

PACKAGE AND METHOD OF FABRICATING THE SAME

REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

Semiconductor Package with Multiple Redistribution Substrates

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PATTERN

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION SUBSTRATE AND METHOD...

SEMICONDUCTOR PACKAGE