Hyeonjun Yun

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Wafer to wafer bonding apparatuses
- Patent number 11,443,965
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Kyeongbin Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEMPERATURE CONTROL SYSTEM AND TEMPERATURE CONTROL METHOD FOR SEMIC...
- Publication number 20240192712
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- HYEONJUN YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER BONDING METHODS AND WAFER TO WAFER BONDING APPARATUSES
- Publication number 20210005475
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Kyeongbin LIM
- H01 - BASIC ELECTRIC ELEMENTS