Hyo Bin PARK

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Yeongi-gun, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming solder resist and substrate for package
- Patent number 9,040,838
- Issue date May 26, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Chang Bo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING SOLDER RESIST AND SUBSTRATE FOR PACKAGE
- Publication number 20140054073
- Publication date Feb 27, 2014
- Samsung Electro-Mechannics Co., Ltd
- Chang Bo LEE
- H01 - BASIC ELECTRIC ELEMENTS