Hyo-Chang Ryu

Person

Seo-gu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor memory device and method of fabricating same
- Patent number 12,200,936
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- G11 - INFORMATION STORAGE
Information Patent Grant
Nonvolatile memory device and method for fabricating the same
- Patent number 11,963,357
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of fabricating the same
- Patent number 11,963,358
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyo Joon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device, electronic system including the same,...
- Patent number 11,910,613
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Hyo Joon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and method of fabricating same
- Patent number 11,856,778
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,721,679
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat dissipation member
- Patent number 11,670,565
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Hyo-Chang Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of fabricating the same
- Patent number 11,581,331
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Hyo Joon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device and method for fabricating the same
- Patent number 11,563,028
- Issue date Jan 24, 2023
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and method of fabricating same
- Patent number 11,502,101
- Issue date Nov 15, 2022
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having logic semiconductor chip and memory pa...
- Patent number 11,217,503
- Issue date Jan 4, 2022
- Samsung Electronics Co., Ltd.
- Yang Gyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a substrate having two silicon laye...
- Patent number 11,145,637
- Issue date Oct 12, 2021
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 10,950,521
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 10,431,522
- Issue date Oct 1, 2019
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 9,899,294
- Issue date Feb 20, 2018
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly including adhesive containment element
- Patent number 8,829,686
- Issue date Sep 9, 2014
- Samsung Electronics Co., Ltd.
- Ji-Sun Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240224525
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Hyo Joon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240155842
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Hyo Joon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20240057336
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- KOHJI KANAMORI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230335540
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- YANGGYOO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230189525
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Hyo Joon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230122331
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- KOHJI KANAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20230084549
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- KOHJI KANAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, ELECTRONIC SYSTEM INCLUDING THE SAME,...
- Publication number 20220359557
- Publication date Nov 10, 2022
- Samsung Electronics Co., Ltd.
- HYO JOON RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20220045096
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- Hyo Joon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210384100
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Hyo-Chang RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20210366884
- Publication date Nov 25, 2021
- Samsung Electronics Co., Ltd.
- YANGGYOO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210313344
- Publication date Oct 7, 2021
- Samsung Electronics Co., Ltd.
- Hyo Joon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210296358
- Publication date Sep 23, 2021
- Samsung Electronics Co., Ltd.
- KOHJI KANAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20210288067
- Publication date Sep 16, 2021
- Samsung Electronics Co., Ltd.
- KOHJI KANAMORI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200395346
- Publication date Dec 17, 2020
- Samsung Electronics Co., Ltd.
- Yang Gyoo JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20200312826
- Publication date Oct 1, 2020
- Samsung Electronics Co., Ltd.
- YANGGYOO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20200006188
- Publication date Jan 2, 2020
- SAMSUNG ELECTRONICS CO., LTD.
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20180145006
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20160190035
- Publication date Jun 30, 2016
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY
- Publication number 20130187288
- Publication date Jul 25, 2013
- Samsung Electronics Co., Ltd.
- Ji-Sun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20110109000
- Publication date May 12, 2011
- Sang-Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS

Hyo-Chang Ryu

Person

Patents Grantslast 30 patents

3D semiconductor memory device and method of fabricating same

Nonvolatile memory device and method for fabricating the same

Semiconductor memory device and method of fabricating the same

Semiconductor memory device, electronic system including the same,...

3D semiconductor memory device and method of fabricating same

Semiconductor package and method of fabricating the same

Semiconductor package with heat dissipation member

Semiconductor memory device and method of fabricating the same

Nonvolatile memory device and method for fabricating the same

3D semiconductor memory device and method of fabricating same

Semiconductor package having logic semiconductor chip and memory pa...

Semiconductor package including a substrate having two silicon laye...

Thermal interface material layer and package-on-package device incl...

Thermal interface material layer and package-on-package device incl...

Thermal interface material layer and package-on-package device incl...

Package-on-package assembly including adhesive containment element

Patents Applicationslast 30 patents

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR MEMORY DEVICE

3D SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

3D SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR MEMORY DEVICE, ELECTRONIC SYSTEM INCLUDING THE SAME,...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

3D SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...

PACKAGE-ON-PACKAGE ASSEMBLY

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME