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Hyon Mo Ku

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  • Singapore, SG
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Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE HAVING A SOLDER-ON-PAD STRUCTURE
    • Publication number 20180012856
    • Publication date Jan 11, 2018
    • Avago Technologies General IP (Singapore) PTE. LTD.
    • Deog Soon Choi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMPED LAND GRID ARRAY
    • Publication number 20180005971
    • Publication date Jan 4, 2018
    • Avago Technologies General IP(Singapore) Pte. Ltd.
    • Ah Ron Lee
    • H01 - BASIC ELECTRIC ELEMENTS