Hyon-soo Kim

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Stack package and method of manufacturing the stack package
- Patent number 10,546,844
- Issue date Jan 28, 2020
- Samsung Electronics Co., Ltd.
- Jae-Choon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer substrate and semiconductor package
- Patent number 10,431,536
- Issue date Oct 1, 2019
- Samsung Electronics Co., Ltd.
- Hyon Chol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photographing apparatus providing image transmission based on commu...
- Patent number 9,723,194
- Issue date Aug 1, 2017
- Samsung Electronics Co., Ltd.
- Hyon-soo Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor packages having warpage compensation
- Patent number 9,048,168
- Issue date Jun 2, 2015
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages having fastening element and halogen-free inter-pack...
- Patent number 9,040,351
- Issue date May 26, 2015
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for communication between server and Customer...
- Patent number 8,880,918
- Issue date Nov 4, 2014
- Samsung Electronics Co., Ltd.
- Doo-Il Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stack package and semiconductor package including the same
- Patent number 8,791,562
- Issue date Jul 29, 2014
- Samsung Electronics Co., Ltd.
- Chung-sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having warpage compensation
- Patent number 8,604,614
- Issue date Dec 10, 2013
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device patterns
- Patent number 8,173,549
- Issue date May 8, 2012
- Samsung Electronics Co., Ltd.
- Young-ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for avoiding undesired incoming telephone calls
- Patent number 5,727,045
- Issue date Mar 10, 1998
- Samsung Electronics Co., Ltd.
- Hyon-Sok Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20190198437
- Publication date Jun 27, 2019
- Samsung Electronics Co., Ltd.
- Hyon Chol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND METHOD OF MANUFACTURING THE STACK PACKAGE
- Publication number 20170154878
- Publication date Jun 1, 2017
- Jae-Choon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...
- Publication number 20140335657
- Publication date Nov 13, 2014
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOGRAPHING APPARATUS, METHOD OF CONTROLLING THE SAME, AND NON-TR...
- Publication number 20140168452
- Publication date Jun 19, 2014
- Samsung Electronics Co., Ltd.
- Hyon-soo Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING WARPAGE COMPENSATION
- Publication number 20140077382
- Publication date Mar 20, 2014
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140061841
- Publication date Mar 6, 2014
- Samsung Electronics Co., Ltd.
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOGRAPHING APPARATUS, METHOD OF CONTROLLING THE SAME, AND COMPUT...
- Publication number 20140055638
- Publication date Feb 27, 2014
- Samsung Electronics Co., Ltd.
- Sang-ryoon Son
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...
- Publication number 20120280404
- Publication date Nov 8, 2012
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20120018871
- Publication date Jan 26, 2012
- Samsung Electronics Co., Ltd.
- Chung-sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING WARPAGE COMPENSATION
- Publication number 20110233771
- Publication date Sep 29, 2011
- SAMSUNG ELECTRONICS CO., LTD.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR COMMUNICATION BETWEEN SERVER AND CUSTOMER...
- Publication number 20110145608
- Publication date Jun 16, 2011
- Samsung Electronics Co. Ltd.
- Doo-Il HWANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE PATTERNS
- Publication number 20090298276
- Publication date Dec 3, 2009
- Young-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Focusing method for digital photographing apparatus
- Publication number 20050185082
- Publication date Aug 25, 2005
- Samsung Techwin Co., Ltd.
- Byoung-kwon Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Hyon-soo Kim

Person

Patents Grantslast 30 patents

Stack package and method of manufacturing the stack package

Interposer substrate and semiconductor package

Photographing apparatus providing image transmission based on commu...

Semiconductor packages having warpage compensation

Stack packages having fastening element and halogen-free inter-pack...

Method and apparatus for communication between server and Customer...

Stack package and semiconductor package including the same

Semiconductor packages having warpage compensation

Methods of forming semiconductor device patterns

System and method for avoiding undesired incoming telephone calls

Patents Applicationslast 30 patents

INTERPOSER SUBSTRATE AND SEMICONDUCTOR PACKAGE

STACK PACKAGE AND METHOD OF MANUFACTURING THE STACK PACKAGE

STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...

PHOTOGRAPHING APPARATUS, METHOD OF CONTROLLING THE SAME, AND NON-TR...

SEMICONDUCTOR PACKAGES HAVING WARPAGE COMPENSATION

SEMICONDUCTOR PACKAGE

PHOTOGRAPHING APPARATUS, METHOD OF CONTROLLING THE SAME, AND COMPUT...

STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...

STACK PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGES HAVING WARPAGE COMPENSATION

METHOD AND APPARATUS FOR COMMUNICATION BETWEEN SERVER AND CUSTOMER...

METHODS OF FORMING SEMICONDUCTOR DEVICE PATTERNS

Focusing method for digital photographing apparatus